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REF3312AIDBZR Datasheet(PDF) 4 Page - Texas Instruments |
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REF3312AIDBZR Datasheet(HTML) 4 Page - Texas Instruments |
4 / 32 page REF3312, REF3318, REF3320, REF3325, REF3330, REF3333 SBOS392E – AUGUST 2007 – REVISED OCTOBER 2014 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted). (1) MIN MAX UNIT Input voltage 7.5 V Voltage Output voltage 5 V Current Output short-circuit, ISC (2) 180 mA Operating temperature –50 150 °C Temperature Junction temperature, TJ 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) See the Power-Supply Recommendations section of this data sheet. 7.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) –4000 4000 Electrostatic V(ESD) Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) –1000 1000 V discharge Machine model (MM) –200 200 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted). MIN NOM MAX UNIT VIN Supply input voltage(1) VOUT + 0.2 5.5 V IOUT Output current range –30 30 mA (1) The minimum supply voltage for the REF3312 is 1.8 V. 7.4 Thermal Information REF3325, REF33xx REF3330 THERMAL METRIC(1) UNIT DCK (SC70) DBZ (SOT-23) RSE (UQFN) 3 PINS 3 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 279.7 313.1 61.2 RθJC(top) Junction-to-case (top) thermal resistance 136.3 144.0 32.6 RθJB Junction-to-board thermal resistance 56.9 109.3 16.0 °C/W ψJT Junction-to-top characterization parameter 11.0 18.2 1.3 ψJB Junction-to-board characterization parameter 56.1 107.9 16.0 RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated Product Folder Links: REF3312 REF3318 REF3320 REF3325 REF3330 REF3333 |
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