INA203, INA204, INA205

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SBOS393E – MARCH 2007 – REVISED NOVEMBER 2015

7 Specifications

7.1 Absolute Maximum Ratings

See

(1)

MIN

MAX

UNIT

18

V

–18

18

V

Current-Shunt Monitor Analog

Common-Mode

–16

80

V

Comparator Analog Input and Reset Pins

GND – 0.3

(Vs) + 0.3

V

Analog Output, Out Pin

GND – 0.3

(Vs) + 0.3

V

Comparator Output, Out Pin

GND – 0.3

18

V

GND – 0.3

10

V

Input Current Into Any Pin

5

mA

Operating Temperature

–55

150

°C

Junction Temperature

–65

150

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

±4000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Vcm Common-mode input voltage

–16

12

80

V

Vs Operating supply voltage

2.7

12

18

V

–40

25

125

ºC

7.4 Thermal Information

INA20x

D (SOIC)

DGS (VSSOP)

PW (TSSOP)

UNIT

14 PINS

10 PINS

14 PINS

Junction-to-ambient thermal resistance

84.9

161.3

112.6

°C/W

Junction-to-case (top) thermal resistance

44

36.8

37.2

°C/W

Junction-to-board thermal resistance

39.4

82.3

55.4

°C/W

Junction-to-top characterization parameter

10.3

1.3

2.7

°C/W

Junction-to-board characterization parameter

39.1

80.8

54.7

°C/W

Junction-to-case (bottom) thermal resistance

150

200

150

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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