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LMV393IDGKR Datasheet(PDF) 4 Page - Texas Instruments |
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LMV393IDGKR Datasheet(HTML) 4 Page - Texas Instruments |
4 / 39 page LMV331, LMV393, LMV339 SLCS136T – AUGUST 1999 – REVISED JANUARY 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage(2) 5.5 V VID Differential input voltage(3) ±5.5 V VI Input voltage range (either input) 0 VCC+ V At or below TA = 25°C, Duration of output short circuit (one amplifier) to ground(4) Unlimited VCC ≤ 5.5 V TJ Operating virtual junction temperature 150 °C Tstg Storage temperature range –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND. (3) Differential voltages are at IN+ with respect to IN–. (4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101, ±1000 all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions MIN MAX UNIT VCC Supply voltage (single-supply operation) 2.7 5.5 V VOUT Output voltage VCC+ + 0.3 V TA Operating free-air temperature –40 125 °C 7.4 Thermal Information LMV339 LMV393 LMV331 THERMAL METRIC(1) D PW RUC D DDU DGK PW DBV DCK UNIT 14 PINS 8 PINS 5 PINS RθJA Junction-to-ambient 86 113 216 97 210 172 149 206 252 thermal resistance RθJC(top) Junction-to-case (top) — — 51.3 — — — — — — thermal resistance RθJB Junction-to-board — — 59.0 — — — — — — thermal resistance °C/W ψJT Junction-to-top characterization — — 1.2 — — — — — — parameter ψJB Junction-to-board characterization — — 59.0 — — — — — — parameter (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated |
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