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OPA197, OPA2197, OPA4197

SBOS737 – JANUARY 2016

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Product Folder Links: OPA197 OPA2197 OPA4197

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Copyright © 2016, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report (SPRA953).

6.4 Thermal Information: OPA197

OPA197

UNIT

D (SOIC)

DBV (SOT)

DGK (VSSOP)

8 PINS

5 PINS

8 PINS

Junction-to-ambient thermal resistance

115.8

158.8

180.4

°C/W

Junction-to-case(top) thermal resistance

60.1

60.7

67.9

°C/W

Junction-to-board thermal resistance

56.4

44.8

102.1

°C/W

Junction-to-top characterization parameter

12.8

1.6

10.4

°C/W

Junction-to-board characterization parameter

55.9

4.2

100.3

°C/W

Junction-to-case(bottom) thermal resistance

N/A

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report (SPRA953).

6.5 Thermal Information: OPA2197

OPA2197

UNIT

D (SOIC)

DGK (VSSOP)

8 PINS

8 PINS

Junction-to-ambient thermal resistance

107.9

158

°C/W

Junction-to-case(top) thermal resistance

53.9

48.6

°C/W

Junction-to-board thermal resistance

48.9

78.7

°C/W

Junction-to-top characterization parameter

6.6

3.9

°C/W

Junction-to-board characterization parameter

48.3

77.3

°C/W

Junction-to-case(bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report (SPRA953).

6.6 Thermal Information: OPA4197

OPA4197

UNIT

D (SOIC)

PW (TSSOP)

14 PINS

14 PINS

Junction-to-ambient thermal resistance

86.4

92.6

°C/W

Junction-to-case(top) thermal resistance

46.3

27.5

°C/W

Junction-to-board thermal resistance

41.0

33.6

°C/W

Junction-to-top characterization parameter

11.3

1.9

°C/W

Junction-to-board characterization parameter

40.7

33.1

°C/W

Junction-to-case(bottom) thermal resistance

N/A

N/A

°C/W