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TLV2460AQDRQ1 Datasheet(PDF) 7 Page - Texas Instruments

Part # TLV2460AQDRQ1
Description  Low-Power Rail-to-Rail Input/Output Operational Amplifiers
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TLV2460AQDRQ1 Datasheet(HTML) 7 Page - Texas Instruments

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TLV2460-Q1, TLV2460A-Q1, TLV2461-Q1, TLV2461A-Q1
TLV2462-Q1, TLV2462A-Q1, TLV2463-Q1, TLV2463A-Q1, TLV2464A-Q1
www.ti.com
SGLS008F – MARCH 2003 – REVISED DECEMBER 2015
7.4 Thermal Information — 8 Pins
TLV2460-Q1,
TLV2462-Q1,
TLV2461-Q1
TLV2462-Q1,
TLV2462-Q1
TLV2462A-Q1
TLV246[0-2]A-Q1
THERMAL METRIC(1)
UNIT
D (SOIC)
PW (TSSOP)
DGK (VSSOP)
8 PINS
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
120.1
183.6
185.7
179.3
°C/W
Junction-to-case (top) thermal
RθJC(top)
68.3
67
69
71.1
°C/W
resistance
RθJB
Junction-to-board thermal resistance
60.4
112.3
114.5
100.4
°C/W
Junction-to-top characterization
ψJT
20.6
9
9.6
10.7
°C/W
parameter
Junction-to-board characterization
ψJB
59.9
110.6
112.7
98.8
°C/W
parameter
Junction-to-case (bottom) thermal
RθJC(bot)
N/A
N/A
N/A
N/A
°C/W
resistance
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
7.5 Thermal Information — 14 pins
TLV2463-Q1,
TLV246[3-4]A-Q1
THERMAL METRIC(1)
UNIT
PW (TSSOP)
14 PINS
RθJA
Junction-to-ambient thermal resistance
119.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
47.9
°C/W
RθJB
Junction-to-board thermal resistance
60.8
°C/W
ψJT
Junction-to-top characterization parameter
5.4
°C/W
ψJB
Junction-to-board characterization parameter
60.2
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Copyright © 2003–2015, Texas Instruments Incorporated
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Product Folder Links: TLV2460-Q1 TLV2460A-Q1 TLV2461-Q1 TLV2461A-Q1 TLV2462-Q1 TLV2462A-Q1 TLV2463-
Q1 TLV2463A-Q1 TLV2464A-Q1


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