Electronic Components Datasheet Search |
|
OPA4188AIPWR Datasheet(PDF) 5 Page - Texas Instruments |
|
|
OPA4188AIPWR Datasheet(HTML) 5 Page - Texas Instruments |
5 / 35 page OPA4188 www.ti.com SBOS641C – JUNE 2012 – REVISED NOVEMBER 2015 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage ±20 40 (single supply) V Voltage (V–) – 0.5 (V+) + 0.5 V Signal input terminals(2) Current ±10 mA Output short circuit(3) Continuous Operating, TA –55 150 °C Temperature Junction, TJ 150 °C Storage, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5-V beyond the supply rails should be current-limited to 10 mA or less. (3) Short-circuit to ground, one amplifier per package. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 Electrostatic V(ESD) V Charged device model (CDM), per JEDEC specification JESD22-C101, all discharge ±1000 pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Power supply voltage, (V+)-(V–) 4 (±2) 36 (±18) V Ambient temperature, TA –40 125 °C 7.4 Thermal Information OPA4188 THERMAL METRIC(1) D (SOIC) PW (TSSOP) UNIT 14 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 93.2 106.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 51.8 24.4 °C/W RθJB Junction-to-board thermal resistance 49.4 59.3 °C/W ψJT Junction-to-top characterization parameter 13.5 0.6 °C/W ψJB Junction-to-board characterization parameter 42.2 54.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: OPA4188 |
Similar Part No. - OPA4188AIPWR |
|
Similar Description - OPA4188AIPWR |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |