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OPA1632D Datasheet(PDF) 4 Page - Texas Instruments |
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OPA1632D Datasheet(HTML) 4 Page - Texas Instruments |
4 / 30 page OPA1632 SBOS286C – DECEMBER 2003 – REVISED OCTOBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT ±VS Supply Voltage ±16.5 V VI Input Voltage ±VS V IO Output Current 150 mA VID Differential Input Voltage ±3 V TJ Maximum Junction Temperature 150 °C Operating Free-Air Temperature Range –40 85 °C TSTG Storage Temperature Range –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The OPA1632 MSOP-8 package version incorporates a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally-dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature, which can permanently damage the device. See TI technical brief SLMA002 for more information about using the PowerPAD thermally-enhanced package. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V V(ESD) Electrostatic discharge Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500 V Machine Model ±200 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Dual ±2.5 ±15 Supply voltage (V+ – V-) V Single 5 30 C-suffic -0 70 TA °C I-suffic .40 85 6.4 Thermal Information OPA1632 D RGN THERMAL METRIC(1) UNIT (SOIC) (MSOP-PowerPAD) 8 PINS 5 PINS RθJA Junction-to-ambient thermal resistance 114.5 59.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 60.3 57.7 °C/W RθJB Junction-to-board thermal resistance 54.8 38.7 °C/W ψJT Junction-to-top characterization parameter 14 2.7 °C/W ψJB Junction-to-board characterization parameter 43.3 38.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a 8.4 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2003–2015, Texas Instruments Incorporated Product Folder Links: OPA1632 |
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