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OPA1632D Datasheet(PDF) 4 Page - Texas Instruments

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Part # OPA1632D
Description  High-Performance, Fully-Differential Audio Operational Amplifier
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

OPA1632D Datasheet(HTML) 4 Page - Texas Instruments

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OPA1632
SBOS286C – DECEMBER 2003 – REVISED OCTOBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
±VS
Supply Voltage
±16.5
V
VI
Input Voltage
±VS
V
IO
Output Current
150
mA
VID
Differential Input Voltage
±3
V
TJ
Maximum Junction Temperature
150
°C
Operating Free-Air Temperature Range
–40
85
°C
TSTG
Storage Temperature Range
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The OPA1632 MSOP-8 package version incorporates a PowerPAD on the underside of the chip. This acts as a heatsink and must be
connected to a thermally-dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction
temperature, which can permanently damage the device. See TI technical brief SLMA002 for more information about using the
PowerPAD thermally-enhanced package.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±1000
V
V(ESD)
Electrostatic discharge
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±500
V
Machine Model
±200
V
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Dual
±2.5
±15
Supply voltage (V+ – V-)
V
Single
5
30
C-suffic
-0
70
TA
°C
I-suffic
.40
85
6.4 Thermal Information
OPA1632
D
RGN
THERMAL METRIC(1)
UNIT
(SOIC)
(MSOP-PowerPAD)
8 PINS
5 PINS
RθJA
Junction-to-ambient thermal resistance
114.5
59.8
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
60.3
57.7
°C/W
RθJB
Junction-to-board thermal resistance
54.8
38.7
°C/W
ψJT
Junction-to-top characterization parameter
14
2.7
°C/W
ψJB
Junction-to-board characterization parameter
43.3
38.4
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
8.4
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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Copyright © 2003–2015, Texas Instruments Incorporated
Product Folder Links: OPA1632


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