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OPA2376AIDGKR Datasheet(PDF) 7 Page - Texas Instruments |
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OPA2376AIDGKR Datasheet(HTML) 7 Page - Texas Instruments |
7 / 42 page OPA376, OPA2376, OPA4376 www.ti.com SBOS406G – JUNE 2007 – REVISED DECEMBER 2015 6.4 Thermal Information: OPA376 OPA376 THERMAL METRIC(1) DBV (SOT-23) DCK (SC70) D (SOIC) UNIT 5 PINS 5 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 273.8 267.0 100.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 126.8 80.9 42.4 °C/W RθJB Junction-to-board thermal resistance 85.9 54.8 41.0 °C/W ψJT Junction-to-top characterization parameter 10.9 1.2 4.8 °C/W ψJB Junction-to-board characterization parameter 84.9 54.1 40.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.5 Thermal Information: OPA2376 OPA2376 THERMAL METRIC(1) D (SOIC) DGK (VSSOP) YZD (DSBGA) UNIT 8 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 111.1 171.2 119.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 54.7 63.9 0.6 °C/W RθJB Junction-to-board thermal resistance 51.7 92.8 27.6 °C/W ψJT Junction-to-top characterization parameter 10.5 9.2 4.0 °C/W ψJB Junction-to-board characterization parameter 51.2 91.2 27.6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see theSemiconductor and IC Package Thermal Metrics application report, SPRA953. 6.6 Thermal Information: OPA4376 OPA4376 THERMAL METRIC(1) PW UNIT 14 PINS RθJA Junction-to-ambient thermal resistance 107.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 29.6 °C/W RθJB Junction-to-board thermal resistance 52.6 °C/W ψJT Junction-to-top characterization parameter 1.5 °C/W ψJB Junction-to-board characterization parameter 51.6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W (1) For more information about traditional and new thermal metrics, see theSemiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 2007–2015, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: OPA376 OPA2376 OPA4376 |
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