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OPA4172IDR Datasheet(PDF) 3 Page - Texas Instruments |
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OPA4172IDR Datasheet(HTML) 3 Page - Texas Instruments |
3 / 50 page OPA172, OPA2172, OPA4172 www.ti.com SBOS618H – DECEMBER 2013 – REVISED SEPTEMBER 2015 Changes from Revision D (September 2014) to Revision E Page • Changed OPA2172 D package from product preview to production data ............................................................................. 1 • Changed Device Information table ......................................................................................................................................... 1 • Changed Device Comparison table note (1) to show preview packages............................................................................... 4 • Added note 2 to pin configurations to show preview packages and deleted previous note .................................................. 5 • Changed Handling Ratings table to ESD Ratings table ......................................................................................................... 7 Changes from Revision C (July 2014) to Revision D Page • Changed low-noise features bullet value from 6 nV/ √Hz to 7 ................................................................................................ 1 • Changed MSOP to VSSOP in features bullet ........................................................................................................................ 1 • Added packages and new note 2 to Device Information table ............................................................................................... 1 • Changed OPAx172 voltage noise density from 6 nV/ √Hz to 7 in Device Family Comparison table ..................................... 4 • Changed OPA4172 package from DGK to PW in Pin Functions table .................................................................................. 6 • Added OPA2172 Thermal Information table........................................................................................................................... 8 • Changed input voltage noise value in Electrical Characteristics from 1.2 µVPP to 2.5 µVPP .................................................. 8 • Changed input voltage noise density value at 100 Hz in Electrical Characteristics from 8.6 nV/ √Hz to 12 .......................... 8 • Changed input voltage noise density value at 1 kHz in Electrical Characteristics from 6 nV/ √Hz to 7.................................. 8 • Changed voltage output swing values in the Electrical Characteristics ................................................................................. 9 • Changed Figure 13 .............................................................................................................................................................. 12 • Changed Figure 14 ............................................................................................................................................................... 12 • Added new note to Applications and Implementation section ............................................................................................. 24 Changes from Revision B (May 2014) to Revision C Page • Changed OPA4172 D package (SOIC-14) from product preview to production data ............................................................ 1 • Added OPA4172-D Thermal information ............................................................................................................................... 8 • Added Channel separation parameter to the Electrical Characteristics ................................................................................. 8 • Added Channel Separation vs Frequency plot .................................................................................................................... 16 Changes from Revision A (April 2014) to Revision B Page • Changed DCK (SC70) package from product preview to production data............................................................................. 1 Changes from Original (December 2013) to Revision A Page • Changed document format to meet latest data sheet standards; added Handling Ratings Recommended Operating Conditions, and Device and Documentation Support sections, and moved existing sections ............................................... 1 • Changed DCK package pin names from IN+ and IN– to +IN and –IN, respectively ............................................................. 5 • Changed DBV package from product preview to production data ......................................................................................... 5 • Changed Figure 9 ................................................................................................................................................................. 11 • Added Functional Block Diagram section............................................................................................................................. 18 • Added Capacitive Load Drive Solution Using an Isolation Resistor section ........................................................................ 24 • Added Power-Supply Recommendations section ................................................................................................................ 27 • Changed Layout Guidelines section..................................................................................................................................... 28 Copyright © 2013–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: OPA172 OPA2172 OPA4172 |
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