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OPA171AIDRLR Datasheet(PDF) 6 Page - Texas Instruments |
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OPA171AIDRLR Datasheet(HTML) 6 Page - Texas Instruments |
6 / 43 page OPA171, OPA2171, OPA4171 SBOS516E – SEPTEMBER 2010 – REVISED JUNE 2015 www.ti.com 6.4 Thermal Information: OPA171 OPA171 THERMAL METRIC(1) D (SO) DBV (SOT23) DRL (SOT553) UNIT 8 PINS 5 PINS 5 PINS RθJA Junction-to-ambient thermal resistance 149.5 245.8 208.1 °C/W RθJC(top) Junction-to-case(top) thermal resistance 97.9 133.9 0.1 °C/W RθJB Junction-to-board thermal resistance 87.7 83.6 42.4 °C/W ψJT Junction-to-top characterization parameter 35.5 18.2 0.5 °C/W ψJB Junction-to-board characterization parameter 89.5 83.1 42.2 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.5 Thermal Information: OPA2171 OPA2171 THERMAL METRIC(1) D (SO) DGK (MSOP) DCU (VSSOP) UNIT 8 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 134.3 175.2 195.3 °C/W RθJC(top) Junction-to-case(top) thermal resistance 72.1 74.9 59.4 °C/W RθJB Junction-to-board thermal resistance 60.6 22.2 115.1 °C/W ψJT Junction-to-top characterization parameter 18.2 1.6 4.7 °C/W ψJB Junction-to-board characterization parameter 53.8 22.8 114.4 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.6 Thermal Information: OPA4171 OPA4171 THERMAL METRIC(1) D (SOIC) PW (TSSOP) UNIT 14 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 93.2 106.9 °C/W RθJC(top) Junction-to-case(top) thermal resistance 51.8 24.4 °C/W RθJB Junction-to-board thermal resistance 49.4 59.3 °C/W ψJT Junction-to-top characterization parameter 13.5 0.6 °C/W ψJB Junction-to-board characterization parameter 42.2 54.3 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6 Submit Documentation Feedback Copyright © 2010–2015, Texas Instruments Incorporated Product Folder Links: OPA171 OPA2171 OPA4171 |
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