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LMP7702MM Datasheet(PDF) 5 Page - Texas Instruments |
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LMP7702MM Datasheet(HTML) 5 Page - Texas Instruments |
5 / 44 page LMP7701, LMP7702, LMP7704 www.ti.com SNOSAI9I – SEPTEMBER 2005 – REVISED NOVEMBER 2015 Pin Functions - LMP7704 PIN I/O DESCRIPTION NAME SOIC, TSSOP IN+ — I Noninverting Input IN– — I Inverting Input IN A + 3 I Noninverting Input for Amplifier A IN A– 2 I Inverting Input for Amplifier A IN B+ 5 I Noninverting Input for Amplifier B IN B– 6 I Inverting Input for Amplifier B IN C+ 10 I Noninverting Input for Amplifier C IN C– 9 I Inverting Input for Amplifier C IN D+ 12 I Noninverting Input for Amplifier D IN D– 13 I Inverting Input for Amplifier D NC — — No connection OUT — O Output OUT A 1 O Output for Amplifier A OUT B 7 O Output for Amplifier B OUT C 8 O Output for Amplifier C OUT D 14 O Output for Amplifier D V+ 4 P Positive Supply V– 11 P Negative Supply 7 Specifications 7.1 Absolute Maximum Ratings See (1) (2) MIN MAX UNIT VIN differential ±300 mV Supply voltage (VS = V + – V−) 13.2 V Voltage at input/output pins V++ 0.3, V− − 0.3 V Input current 10 mA Junction temperature (3) +150 °C Infrared or convection (20 sec) 235 °C Soldering information Wave soldering lead temp. (10 sec) 260 °C Storage temperature, Tstg −65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, contact the TI Sales Office/ Distributors for availability and specifications. (3) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000 Electrostatic V(ESD) Charged-device model (CDM), per JEDEC specification JESD22-C101(3) ±1000 V discharge Machine Model (MM) ±200 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). (3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Copyright © 2005–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LMP7701 LMP7702 LMP7704 |
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