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LEADFRAME

Data Sheet

DS587D

Rev Date: 7/12

Process Highlights

• Die thickness

10.0 ± .5 mils

• Strip solder plating

Matte Sn or Ni/Pd/Au

• Strip marking

Laser

• Lead inspection

Laser/optical

• Pack/ship options

Bar code, dry pack

• Wafer backgrinding

Available

Test Services

• Program generation/conversion

• Product engineering support

• Wafer sort

• Available test/handling technology

• Burn-in capabilities

Shipping

• JEDEC outline CS-007 low profile tray

Configuration Options

Body Size

(mm)

Total Max IO Number Possible

Peripheral Lead

Max Die Pad Size (mm)

Dual Row Land

Single Row Land

0.4 pitch

0.5 pitch

0.4 pitch

0.5 pitch

0.4 pitch

0.5 pitch

0.4 pitch

0.5 pitch

10 x 10

164

132

148

116

88

64

5.3

5.3

12 x 12

200

164

176

140

108

80

6.5

6.5

14 x 14

228

192

204

168

128

100

7.3

7.5

16 x 16

264

224

236

196

148

120

8.5

8.7

20 x 20

316

264

280

228

184

144

9.7

10

24 x 24

356

296

320

260

224

176

9.7

10

Note: Above are estimates only.

Detailed designs have not yet been implemented for all options.

Actual pin counts are pad size dependent.

Gold Wire

Mold Compound

Die

Cu Leadframe

Exposed Lands

Exposed Die

Paddle

less than

1.00mm

Seat Height

0.8mm

Body

SOH: .05

nominal

Dual Row Exposed Land Design

Single Row Exposed Land Design

less than

1.00mm

Seat Height

0.8mm

Body

SOH: .05

nominal

Internal Power

Ring / Bar