DMTH6010LPS

Document number: DS37354 Rev. 5 - 2

2 of 7

www.diodes.com

November 2015

© Diodes Incorporated

DMTH6010LPS

Characteristic

Symbol

Value

Unit

Drain-Source Voltage

60

V

Gate-Source Voltage

±20

V

Continuous Drain Current (Note 5)

13.5

10.4

A

Continuous Drain Current (Note 6)

(Note 8)

100

A

75

Maximum Continuous Body Diode Forward Current (Note 6)

100

A

Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)

140

A

Avalanche Current, L=0.1mH

20

A

Avalanche Energy, L=0.1mH

20

mJ

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Total Power Dissipation (Note 5)

2.6

W

Thermal Resistance, Junction to Ambient (Note 5)

57

°C/W

Total Power Dissipation (Note 6)

136

W

Thermal Resistance, Junction to Case (Note 6)

1.1

°C/W

Operating and Storage Temperature Range

-55 to +175

°C

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 7)

Drain-Source Breakdown Voltage

60

—

—

V

Zero Gate Voltage Drain Current

—

—

1

μA

Gate-Source Leakage

—

—

±100

nA

ON CHARACTERISTICS (Note 7)

Gate Threshold Voltage

1

—

3

V

Static Drain-Source On-Resistance

—

5.4

8

m

Ω

—

8.3

12

Diode Forward Voltage

—

0.8

1.2

V

DYNAMIC CHARACTERISTICS (Note 8)

Input Capacitance

—

2,090

—

pF

f = 1MHz

Output Capacitance

—

746

—

Reverse Transfer Capacitance

—

38.5

—

Gate Resistance

0.2

0.59

1.5

Ω

—

19.3

—

nC

—

41.3

—

Gate-Source Charge

—

6

—

Gate-Drain Charge

—

8.8

—

Turn-On Delay Time

—

5.7

—

ns

Turn-On Rise Time

—

4.3

—

Turn-Off Delay Time

—

23.4

—

Turn-Off Fall Time

—

9.7

—

Body Diode Reverse Recovery Time

—

35.4

—

ns

Body Diode Reverse Recovery Charge

—

38.2

—

nC

Notes:

5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.

6. Thermal resistance from junction to soldering point (on the exposed drain pad).

7. Short duration pulse test used to minimize self-heating effect.

8. Guaranteed by design. Not subject to product testing.