NL17SGU04

http://onsemi.com

8

PACKAGE DIMENSIONS

UDFN6 1.45x1.0, 0.5P

CASE 517AQ

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.30 mm FROM THE TERMINAL TIP.

A

B

E

D

BOTTOM VIEW

b

e

6X

0.10

B

0.05

A

C

C

L

6X

NOTE 3

0.10 C

PIN ONE

REFERENCE

TOP VIEW

0.10 C

6X

A

A1

0.05 C

0.05 C

C

SEATING

PLANE

SIDE VIEW

1

3

4

6

DIM

MIN

MAX

MILLIMETERS

A

0.45

0.55

A1

0.00

0.05

b

0.20

0.30

D

1.45 BSC

E

1.00 BSC

e

0.50 BSC

L

0.30

0.40

L1

−−−

0.15

DIMENSIONS: MILLIMETERS

0.30

6X

1.24

0.53

PITCH

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

0.50

1

MOUNTING FOOTPRINT

PACKAGE

OUTLINE

L1

DETAIL A

L

OPTIONAL

CONSTRUCTIONS

L

DETAIL B

MOLD CMPD

EXPOSED Cu

OPTIONAL

CONSTRUCTIONS

A2

0.07 REF

6X

A2

DETAIL B

DETAIL A