NL17SH02

http://onsemi.com

5

PACKAGE DIMENSIONS

SOT−953

CASE 527AE

ISSUE E

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

E

D

C

A

12 3

4

5

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH. MINIMUM LEAD THICKNESS IS THE

MINIMUM THICKNESS OF THE BASE MATERIAL.

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS, OR GATE BURRS.

DIM

MIN

NOM

MAX

MILLIMETERS

A

0.34

0.37

0.40

b

0.10

0.15

0.20

C

0.07

0.12

0.17

D

0.95

1.00

1.05

E

0.75

0.80

0.85

e

0.35 BSC

L

0.95

1.00

1.05

X

Y

PIN ONE

INDICATOR

b

5X

X

0.08

Y

L

5X

L3

L2

e

5X

5X

L2

0.05

0.10

0.15

L3

−−−

−−−

0.15

0.175 REF

TOP VIEW

SIDE VIEW

BOTTOM VIEW

1.20

DIMENSIONS: MILLIMETERS

0.20

5X

1

PACKAGE

OUTLINE

0.35

PITCH

0.35

5X

ON Semiconductor and

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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NL17SH02/D

MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC).

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