NCP81045

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5

PIN FUNCTION DESCRIPTION

Pin No.

Symbol

Description

1

VIN

Input voltage used for feed forward in switcher operation.

2

VCC

Supply for analog circuit

3

SYN

Synchronization interleaving use.

4

EN

This pin serves as two functions. Enable: Logic control for enabling the switcher. MASTER/SLAVE: To

program the device as MASTER or SLAVE mode at dual device operation.

5

COMP

Output of the error amplifier.

6

FB

Output voltage feed back.

7

IDRP/OCP

Current limit programmable and setting for AVP.

8

CS−/Vo

Inductor current differential sense inverting input.

9

CS+

Inductor current differential sense non−inverting input.

10

PGND

Ground reference and high−current return path for the bottom gate driver.

11

DL/TRESET

Gate driver output of bottom N−channel MOSFET. It also has the function for TRE threshold setting.

12

VCCP

Supply for bottom gate driver.

13

BST

Top gate driver input supply, a bootstrap capacitor connection between SWN and this pin.

14

DH

Gate driver output of top N−channel MOSFET.

15

SWN

Switch node between top MOSFET and bottom MOSFET.

16

PGOOD

Power good indicator of the output voltage. High impendence if power good (in regulation). Low im-

pendence if power not good.

17

TPAD

Copper pad on bottom of IC used for heat sinking. This pin should be connected to the analog ground

plane under the IC.

ABSOLUTE MAXIMUM RATINGS

Rating

Symbol

Value

Unit

VCC Power Supply Voltage to AGND

−0.3, 6.0

V

VIN Supply to AGND

−0.3, 30

V

High−side Gate Drive Supply: BST to SWN

High−side Gate Drive Voltage: DH to SWN

Low−side Gate Drive Supply: VCCP to PGND

Low−side Gate Drive Voltage: DL to PGND

−0.3, 6.0

V

Input / Output Pins to AGND

−0.3, 6.0

V

Switch Node SWN−PGND

−5 V (< 100 ns)

30 V

V

High−Side Gate Drive/Low−Side Gate Drive Outputs

DH, DL

−3(DC)

V

PGND

−0.3, 0.3

V

Thermal Characteristics

Thermal Resistance Junction−to−Ambient (QFN16 Package)

48

°C/W

Operating Junction Temperature Range (Note 1)

−40 to + 150

°C

Operating Ambient Temperature Range

− 40 to + 85

°C

Storage Temperature Range

− 55 to +150

°C

Moisture Sensitivity Level

MSL

1

−

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.

1. Internally limited by thermal shutdown, 150°C min.