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NCP81045 Datasheet(PDF) 5 Page - ON Semiconductor |
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NCP81045 Datasheet(HTML) 5 Page - ON Semiconductor |
5 / 17 page NCP81045 http://onsemi.com 5 PIN FUNCTION DESCRIPTION Pin No. Symbol Description 1 VIN Input voltage used for feed forward in switcher operation. 2 VCC Supply for analog circuit 3 SYN Synchronization interleaving use. 4 EN This pin serves as two functions. Enable: Logic control for enabling the switcher. MASTER/SLAVE: To program the device as MASTER or SLAVE mode at dual device operation. 5 COMP Output of the error amplifier. 6 FB Output voltage feed back. 7 IDRP/OCP Current limit programmable and setting for AVP. 8 CS−/Vo Inductor current differential sense inverting input. 9 CS+ Inductor current differential sense non−inverting input. 10 PGND Ground reference and high−current return path for the bottom gate driver. 11 DL/TRESET Gate driver output of bottom N−channel MOSFET. It also has the function for TRE threshold setting. 12 VCCP Supply for bottom gate driver. 13 BST Top gate driver input supply, a bootstrap capacitor connection between SWN and this pin. 14 DH Gate driver output of top N−channel MOSFET. 15 SWN Switch node between top MOSFET and bottom MOSFET. 16 PGOOD Power good indicator of the output voltage. High impendence if power good (in regulation). Low im- pendence if power not good. 17 TPAD Copper pad on bottom of IC used for heat sinking. This pin should be connected to the analog ground plane under the IC. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit VCC Power Supply Voltage to AGND VCC −0.3, 6.0 V VIN Supply to AGND VIN −0.3, 30 V High−side Gate Drive Supply: BST to SWN High−side Gate Drive Voltage: DH to SWN Low−side Gate Drive Supply: VCCP to PGND Low−side Gate Drive Voltage: DL to PGND VBST−VSWN, VDH−VSWN, VCCP−VPGND, VDL−VPGND, −0.3, 6.0 V Input / Output Pins to AGND VIO −0.3, 6.0 V Switch Node SWN−PGND VSWN −5 V (< 100 ns) 30 V V High−Side Gate Drive/Low−Side Gate Drive Outputs DH, DL −3(DC) V PGND VPGND −0.3, 0.3 V Thermal Characteristics Thermal Resistance Junction−to−Ambient (QFN16 Package) RqJA 48 °C/W Operating Junction Temperature Range (Note 1) TJ −40 to + 150 °C Operating Ambient Temperature Range TA − 40 to + 85 °C Storage Temperature Range Tstg − 55 to +150 °C Moisture Sensitivity Level MSL 1 − Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. NOTE: This device is ESD sensitive. Use standard ESD precautions when handling. 1. Internally limited by thermal shutdown, 150°C min. |
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