NLAS9031

http://onsemi.com

9

PACKAGE DIMENSIONS

SC−88/SOT−363/SC−70

DF SUFFIX

CASE 419B−02

ISSUE W

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

mm

inches

SCALE 20:1

0.65

0.025

0.65

0.025

0.50

0.0197

0.40

0.0157

1.9

0.0748

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.

E

12

3

D

e

A1

A

A3

C

L

65

4

−E−

DIM MIN

NOM

MAX

MILLIMETERS

A

0.80

0.95

1.10

A1

0.00

0.05

0.10

A3

b

0.10

0.21

0.30

C

0.10

0.14

0.25

D

1.80

2.00

2.20

0.031 0.037 0.043

0.000 0.002 0.004

0.004 0.008 0.012

0.004 0.005 0.010

0.070 0.078 0.086

MIN

NOM

MAX

INCHES

0.20 REF

0.008 REF

E

1.15

1.25

1.35

e

0.65 BSC

L

0.10

0.20

0.30

2.00

2.10

2.20

0.045 0.049 0.053

0.026 BSC

0.004 0.008 0.012

0.078 0.082 0.086