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MTW24N40E Datasheet(PDF) 1 Page - ON Semiconductor

Part No. MTW24N40E
Description  N?묬hannel Power MOSFET
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MTW24N40E Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2000
September, 2000 − Rev. XXX
1
Publication Order Number:
MTW24N40E/D
MTW24N40E
Preferred Device
Power MOSFET
24 Amps, 400 Volts
N−Channel TO−247
This high voltage MOSFET uses an advanced termination scheme
to provide enhanced voltage−blocking capability without degrading
performance over time. In addition, this advanced Power MOSFET is
designed to withstand high energy in the avalanche and commutation
modes. The new energy efficient design also offers a drain−to−source
diode with a fast recovery time. Designed for high voltage, high speed
switching applications in power supplies, converters and PWM motor
controls, these devices are particularly well suited for bridge circuits
where diode speed and commutating safe operating areas are critical
and offer additional safety margin against unexpected voltage
transients.
Robust High Voltage Termination
Avalanche Energy Specified
Source−to−Drain Diode Recovery Time Comparable to a Discrete
Fast Recovery Diode
Diode is Characterized for Use in Bridge Circuits
I
DSS and VDS(on) Specified at Elevated Temperature
Isolated Mounting Hole Reduces Mounting Hardware
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Drain−Source Voltage
VDSS
400
Vdc
Drain−Gate Voltage (RGS = 1.0 MΩ)
VDGR
400
Vdc
Gate−Source Voltage
− Continuous
− Non−Repetitive (tp ≤ 10 ms)
VGS
VGSM
± 20
± 40
Vdc
Vpk
Drain Current − Continuous
Drain Current − Continuous @ 100
°C
Drain Current − Single Pulse (tp ≤ 10 µs)
ID
ID
IDM
24
17.7
72
Adc
Apk
Total Power Dissipation
Derate above 25
°C
PD
250
2.0
Watts
W/
°C
Operating and Storage Temperature Range
TJ, Tstg
− 55 to
150
°C
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = 100 Vdc, VGS = 10 Vdc,
IL = 20 Apk, L = 3.0 mH, RG = 25 Ω)
EAS
600
mJ
Thermal Resistance − Junction to Case
Thermal Resistance − Junction to Ambient
RθJC
RθJA
0.50
40
°C/W
Maximum Lead Temperature for Soldering
Purposes, 1/8
″ from case for 10 seconds
TL
260
°C
Device
Package
Shipping
ORDERING INFORMATION
MTW24N40E
TO−247
30 Units/Rail
Preferred devices are recommended choices for future use
and best overall value.
LL
= Location Code
Y
= Year
WW
= Work Week
MTW24N40E
LLYWW
http://onsemi.com
MARKING DIAGRAM
& PIN ASSIGNMENT
D
G
TO−247AE
CASE 340K
Style 1
N−Channel
S
24 AMPERES
400 VOLTS
RDS(on) = 160 mΩ
1
2
3
4
1
Gate
3
Source
4
Drain
2
Drain


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