LC898119XC

www.onsemi.com

3

Package Dimensions

unit : mm

WLCSP25, 2.0x2.0

CASE 567HK

ISSUE O

SEATING

PLANE

0.10 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

2X

DIM

A

MIN

MAX

MILLIMETERS

A1

D

2.00 BSC

E

b

0.21

0.31

e

0.40 BSC

0.675

D

E

A

B

PIN A1

REFERENCE

e

A

0.05

B

C

0.03 C

0.05 C

25X

b

45

C

B

A

0.10 C

A

A1

C

0.15

0.25

2.00 BSC

0.22

25X

DIMENSIONS: MILLIMETERS

*For additional information on our Pb-Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.40

0.40

0.10 C

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

e

RECOMMENDED

PACKAGE

OUTLINE

123

PITCH

D

E

PITCH

A1