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SAA5520 Datasheet(PDF) 2 Page - NXP Semiconductors |
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SAA5520 Datasheet(HTML) 2 Page - NXP Semiconductors |
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2 / 80 page  1999 Oct 27 2 Philips Semiconductors Preliminary specification Standard TV microcontrollers with On-Screen Display (OSD) SAA55xx CONTENTS 1 FEATURES 2 GENERAL DESCRIPTION 3 QUICK REFERENCE DATA 4 ORDERING INFORMATION 5 BLOCK DIAGRAM 6 PINNING INFORMATION 6.1 Pinning 6.2 Pin description 7 MICROCONTROLLER 7.1 Microcontroller features 8 MEMORY ORGANISATION 8.1 Security bits - program and verify 8.2 RAM organisation 8.3 Data memory 8.4 SFR memory 8.5 Character set feature bits 8.6 External (auxiliary) memory 9 POWER-ON RESET 10 REDUCED POWER MODES 10.1 Idle mode 10.2 Power-down mode 10.3 Standby mode 11 I/O FACILITY 11.1 I/O ports 11.2 Port type 11.3 Port alternate functions 11.4 LED support 12 INTERRUPT SYSTEM 12.1 Interrupt enable structure 12.2 Interrupt enable priority 12.3 Interrupt vector address 12.4 Level/edge interrupt 13 TIMER/COUNTER 14 WATCHDOG TIMER 14.1 Watchdog Timer operation 15 PULSE WIDTH MODULATORS 15.1 PWM control 15.2 Tuning Pulse Width Modulator (TPWM) 15.3 Software ADC (SAD) 16 I2C-BUS SERIAL I/O 16.1 I2C-bus port selection 17 MEMORY INTERFACE 17.1 Memory structure 17.2 Memory mapping 17.3 Addressing memory 17.4 Page clearing 18 DATA CAPTURE 18.1 Data Capture Features 18.2 Broadcast service data detection 18.3 VPS acquisition 18.4 WSS acquisition 19 DISPLAY 19.1 Display features 19.2 Display mode 19.3 Display feature descriptions 19.4 Character and attribute coding 19.5 Screen and global controls 19.6 Screen colour 19.7 Text display control 19.8 Display positioning 19.9 Character set 19.10 Display synchronization 19.11 Video/data switch (fast blanking) polarity 19.12 Video/data switch adjustment 19.13 RGB brightness control 19.14 Contrast reduction 20 MEMORY MAPPED REGISTERS 21 LIMITING VALUES 22 CHARACTERISTICS 22.1 I2C-bus characteristics 23 QUALITY AND RELIABILITY 23.1 Group A 23.2 Group B 23.3 Group C 24 APPLICATION INFORMATION 25 ELECTROMAGNETIC COMPATIBILITY (EMC) GUIDELINES 26 PACKAGE OUTLINE 27 SOLDERING 27.1 Introduction to soldering through-hole mount packages 27.2 Soldering by dipping or by solder wave 27.3 Manual soldering 27.4 Suitability of through-hole mount IC packages for dipping and wave soldering methods 28 DEFINITIONS 29 LIFE SUPPORT APPLICATIONS 30 PURCHASE OF PHILIPS I2C COMPONENTS |
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Similar Description - SAA5520 |
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