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AM29F016D-120E4EB Datasheet(PDF) 4 Page - Advanced Micro Devices |
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AM29F016D-120E4EB Datasheet(HTML) 4 Page - Advanced Micro Devices |
4 / 45 page Am29F016D 3 TABLE OF CONTENTS Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 5 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8 Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 9 Table 1. Am29F016D Device Bus Operations .................................. 9 Requirements for Reading Array Data ..................................... 9 Writing Commands/Command Sequences .............................. 9 Program and Erase Operation Status .................................... 10 Standby Mode ........................................................................ 10 RESET#: Hardware Reset Pin ............................................... 10 Output Disable Mode.............................................................. 10 Table 2. Sector Address Table........................................................ 11 Autoselect Mode..................................................................... 12 Table 3. Am29F016D Autoselect Codes (High Voltage Method).... 12 Sector Group Protection/Unprotection.................................... 12 Table 4. Sector Group Addresses................................................... 12 Temporary Sector Group Unprotect ....................................... 12 Figure 1. Temporary Sector Group Unprotect Operation................ 13 Hardware Data Protection ...................................................... 13 Low VCC Write Inhibit...................................................................... 13 Write Pulse “Glitch” Protection ........................................................ 13 Logical Inhibit .................................................................................. 13 Power-Up Write Inhibit .................................................................... 13 Common Flash Memory Interface (CFI) . . . . . . . 14 Table 5. CFI Query Identification String .......................................... 14 Table 6. System Interface String..................................................... 14 Table 7. Device Geometry Definition .............................................. 15 Table 8. Primary Vendor-Specific Extended Query ........................ 15 Command Definitions . . . . . . . . . . . . . . . . . . . . . 16 Reading Array Data ................................................................ 16 Reset Command..................................................................... 16 Autoselect Command Sequence ............................................ 16 Byte Program Command Sequence ....................................... 16 Unlock Bypass Command Sequence.............................................. 17 Figure 2. Program Operation .......................................................... 17 Chip Erase Command Sequence ........................................... 17 Sector Erase Command Sequence ........................................ 18 Erase Suspend/Erase Resume Commands........................... 18 Figure 3. Erase Operation............................................................... 19 Command Definitions ............................................................. 20 Table 9. Am29F016D Command Definitions................................... 20 Write Operation Status . . . . . . . . . . . . . . . . . . . . 21 DQ7: Data# Polling................................................................. 21 Figure 4. Data# Polling Algorithm ................................................... 21 RY/BY#: Ready/Busy# ........................................................... 22 DQ6: Toggle Bit I .................................................................... 22 DQ2: Toggle Bit II ................................................................... 22 Reading Toggle Bits DQ6/DQ2 .............................................. 22 DQ5: Exceeded Timing Limits ................................................ 23 DQ3: Sector Erase Timer ....................................................... 23 Figure 5. Toggle Bit Algorithm........................................................ 23 Table 10. Write Operation Status................................................... 24 Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 25 Figure 6. Maximum Negative Overshoot Waveform ...................... 25 Figure 7. Maximum Positive Overshoot Waveform........................ 25 Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 25 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 26 TTL/NMOS Compatible .......................................................... 26 CMOS Compatible.................................................................. 26 Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Figure 8. Test Setup...................................................................... 27 Table 11. Test Specifications ......................................................... 27 Key to Switching Waveforms. . . . . . . . . . . . . . . . 27 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 28 Read-only Operations............................................................. 28 Figure 9. Read Operation Timings ................................................. 28 Figure 10. RESET# Timings .......................................................... 29 Erase/Program Operations ..................................................... 30 Figure 11. Program Operation Timings.......................................... 31 Figure 12. Chip/Sector Erase Operation Timings .......................... 32 Figure 13. Data# Polling Timings (During Embedded Algorithms). 33 Figure 14. Toggle Bit Timings (During Embedded Algorithms)...... 33 Figure 15. DQ2 vs. DQ6................................................................. 34 Figure 16. Temporary Sector Group Unprotect Timings ................ 34 Erase and Program Operations .............................................. 35 Alternate CE# Controlled Writes .................................................... 35 Figure 17. Alternate CE# Controlled Write Operation Timings ...... 36 Erase and Programming Performance . . . . . . . 37 Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 37 TSOP and SO Pin Capacitance . . . . . . . . . . . . . . 37 Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 38 TS 040—40-Pin Standard Thin Small Outline Package ......... 38 TSR040—40-Pin Reverse Thin Small Outline Package......... 39 TS 048—48-Pin Standard Thin Small Outline Package ......... 40 TSR048—48-Pin Reverse Thin Small Outline Package......... 41 SO 044—44-Pin Small Outline Package ................................ 42 Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 43 Revision A (May 1997) ........................................................... 43 Revision B (January 1998) ..................................................... 43 Revision B+1 (January 1998) ................................................. 43 Revision B+2 (April 1998)....................................................... 43 Revision C (January 1999) ..................................................... 43 Revision C+1 (March 23, 1999).............................................. 43 Revision C+2 (May 17, 1999) ................................................. 43 Revision C+3 (July 2, 1999) ................................................... 43 Revision D (November 16, 1999) ........................................... 43 Revision E (May 19, 2000) ..................................................... 44 Revision E+1 (December 4, 2000) ......................................... 44 Revision E+2 (March 23, 2001) .............................................. 44 |
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