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ISO7831 Datasheet(PDF) 5 Page - Texas Instruments |
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ISO7831 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 32 page ISO7831, ISO7831F www.ti.com SLLSEP8A – JULY 2015 – REVISED SEPTEMBER 2015 6.4 Thermal Information DW (SOIC) THERMAL METRIC(1) UNIT 16 Pins RθJA Junction-to-ambient thermal resistance 78.9 RθJC(top) Junction-to-case(top) thermal resistance 41.6 RθJB Junction-to-board thermal resistance 43.6 °C/W ψJT Junction-to-top characterization parameter 15.5 ψJB Junction-to-board characterization parameter 43.1 RθJC(bottom) Junction-to-case(bottom) thermal resistance N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 6.5 Power Rating VALUE UNIT PD Maximum power dissipation by ISO7831 150 VCC1 = VCC2 = 5.5 V, TJ = 150°C, PD1 Maximum power dissipation by side-1 of ISO7831 CL = 15 pF, input a 50 MHz 50% duty cycle 50 mW square wave PD2 Maximum power dissipation by side-2 of ISO7831 100 Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: ISO7831 ISO7831F |
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