DG200CJ datasheet(8/8 Pages) HARRIS

Part #	DG200CJ

Description	CMOS Dual/Quad SPST Analog Switches

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Manufacturer	HARRIS [Harris Corporation]

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DG201

Metallization Topology

DIE DIMENSIONS:

94 x 101 x 14

± 1mils

METALLIZATION:

Type: Al

Thickness: 10k

Å

± 1kÅ

GLASSIVATION:

Type: SiO2/Si3N4

SiO2 Thickness: 7kÅ ± 1.4kÅ

Si3N4 Thickness: 8kÅ ± 1.2kÅ

WORST CASE CURRENT DENSITY:

1 x 105 A/cm2

Metallization Mask Layout

DG201

S1 (3)

V- (4)

GND (5)

S4 (6)

IN2

(16)

IN1

(1)

D1

(2)

(11) S3

(13) V+ (SUBSTRATE)*

(14) S2

(15)

(7)

D4

(8)

IN4

(9)

IN3

(10)

D3

D2

* Backside of Chip is V+

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