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NCV70627DQ001G Datasheet(PDF) 2 Page - ON Semiconductor |
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NCV70627DQ001G Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 61 page NCV70627 www.onsemi.com 2 Applications The NCV70627 is ideally suited for small positioning applications. Target markets include: automotive (headlamp alignment, HVAC, idle control, cruise control), industrial equipment (lighting, fluid control, labeling, process control, XYZ tables, robots...) and building automation (HVAC, surveillance, satellite dish, renewable energy systems). Suitable applications typically have multiple axes or require mechatronics solutions with the driver chip mounted directly on the motor. Table 1. ORDERING INFORMATION Part No. Peak Current End Market/Version Package* Shipping† NCV70627DQ001G 800/1100 mA (Note 2) Automotive High Temperature Version SSOP−36EP (Pb−Free) 47 Units/Rail NCV70627DQ001R2G 800/1100 mA (Note 2) 1500/Tape & Reel NCV70627MW002R2G 800/1100 mA (Note 2) Automotive QFN32 (Pb−Free) 5000 / Tape & Reel *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 2. The device boost current. This applies for operation under the thermal warning level only. NCV70627 AWLYYWWG MARKING DIAGRAMS A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G or G = Pb−Free Package N70627−2 AWLYYWW G G 1 (Note: Microdot may be in either location) SSOP QFN32 Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Min Max Unit VBB, VHW2 Supply voltage, hardwired address pin (Note 4) −0.3 +40 (Note 3) V Vlin Bus input voltage (Note 4) −40 +40 V TJ Junction temperature range (Note 5) −50 +175 °C Tstg Storage temperature range (Note 6) −55 +160 °C Vesd (Note 7) HBM Electrostatic discharge voltage on LIN pin −4 +4 kV HBM Electrostatic discharge voltage on other pins −2 +2 kV MM Electrostatic discharge voltage on other pins −200 +200 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. NOTE: A mission profile (Note 5) is a substantial part of the operation conditions; hence the Customer must contact ON Semiconductor in order to mutually agree in writing on the allowed missions profile(s) in the application. 3. For limited time: VBB <0.5 s, SWI and HW2 pins <1.0 s. 4. Maximum allowed voltage between two device pins is 60 V. 5. The circuit functionality is not guaranteed outside the Operating junction temperature range. A mission profile describes the application specific conditions such as, but not limited to, the cumulative operating conditions over life time, the system power dissipation, the system’s environmental conditions, the thermal design of the customer’s system, the modes, in which the device is operated by the customer, etc. 6. For limited time up to 100 hours. Otherwise the maximum storage temperature is 85 °C. 7. HBM according to AEC−Q100: EIA−JESD22−A114−B (100 pF via 1.5 k W) and MM according to AEC−Q100: EIA−JESD22−A115−A. Table 3. OPERATING RANGES Parameter Min Max Unit VBB Supply voltage +5.5 +29 V TJP Parametric Operating junction temperature range (Note 8) −40 +145 °C TJF Functional Operating junction temperature range (Note 9) −40 +160 °C 8. The parametric characteristics of the circuit are not guaranteed outside the parametric operating junction temperature range. 9. The maximum functional operating temperature range can be limited by thermal shutdown Ttsd. |
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