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TLV1702-Q1 Datasheet(PDF) 5 Page - Texas Instruments

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Part # TLV1702-Q1
Description  TLV170x-Q1 2.2-V to 36-V, microPower Comparator
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TLV1702-Q1 Datasheet(HTML) 5 Page - Texas Instruments

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TLV1702-Q1, TLV1704-Q1
www.ti.com
SLOS890A – NOVEMBER 2015 – REVISED DECEMBER 2015
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Supply voltage
40 (±20)
V
Voltage(2)
(VS–) – 0.5
(VS+) + 0.5
V
Signal input pins
Current(2)
±10
mA
Output short-circuit(3)
Continuous
mA
Operating temperature
–55
150
°C
Junction temperature, TJ
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails must be
current limited to 10 mA or less.
(3)
Short-circuit to ground; one comparator per package.
7.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per AEC Q100-002(1)
±1000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per AEC Q100-011
±1000
(1)
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
Supply voltage VS = (VS+) – (VS–)
2.2 (±1.1)
36 (±18)
V
Specified temperature
–40
125
°C
7.4 Thermal Information
TLV1702-Q1
TLV1704-Q1
THERMAL METRIC(1)
DGK (VSSOP)
PW (TSSOP)
UNIT
8 PINS
14 PINS
RθJA
Junction-to-ambient thermal resistance
199
128.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
89.5
56.5
°C/W
RθJB
Junction-to-board thermal resistance
120.4
69.9
°C/W
ψJT
Junction-to-top characterization parameter
22
9.1
°C/W
ψJB
Junction-to-board characterization parameter
118.7
69.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Copyright © 2015, Texas Instruments Incorporated
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