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TPS2831 Datasheet(PDF) 3 Page - Texas Instruments |
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TPS2831 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 17 page TPS2836, TPS2837 SYNCHRONOUSBUCK MOSFET DRIVER WITH DEADTIME CONTROL SLVS224B − NOVEMBER 1999 − REVISED AUGUST 2002 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 detailed description low-side driver The low-side driver is designed to drive low rDS(on) N-channel MOSFETs. The current rating of the driver is 2 A, source and sink. high-side driver The high-side driver is designed to drive low rDS(on) N-channel MOSFETs. The current rating of the driver is 2 A, source and sink. The high-side driver can be configured as a ground-reference driver or a floating bootstrap driver. The internal bootstrap diode is a Schottky for improved drive efficiency. The maximum voltage that can be applied between the BOOT terminal and ground is 30 V. dead-time (DT) control Dead-time control prevents shoot-through current from flowing through the main power FETs during switching transitions by controlling the turnon times of the MOSFET drivers. The high-side driver is not allowed to turn on until the gate drive voltage to the low-side FET is low, and the low-side driver is not allowed to turn on until the voltage at the junction of the power FETs (Vdrain) is low; the TTL-compatible DT terminal connects to the junction of the power FETs. IN The IN terminal is a TTL-compatible digital terminal that is the input control signal for the drivers. The TPS2836 has a noninverting input; the TPS2837 has an inverting input. absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage range, VCC (see Note 1) −0.3 V to 16 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input voltage range: BOOT to PGND (high-side driver ON) −0.3 V to 30 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BOOTLO to PGND −0.3 V to 16 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BOOT to BOOTLO −0.3 V to 16 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IN −0.3 V to 16 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DT −0.3 V to 30 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous total power dissipation See Dissipation Rating Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating virtual junction temperature range, TJ −40 °C to 125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, Tstg −65 °C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds 260 °C . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: Unless otherwise specified, all voltages are with respect to PGND. DISSIPATION RATING TABLE PACKAGE TA ≤ 25°C POWER RATING DERATING FACTOR ABOVE TA = 25°C TA = 70°C POWER RATING TA = 85°C POWER RATING D 600 mW 6.0 mW/ °C 330 mW 240 mW recommended operating conditions MIN NOM MAX UNIT Supply voltage, VCC 4.5 15 V Input voltage BOOT to PGND 4.5 28 V |
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