TPS2836, TPS2837

SYNCHRONOUSBUCK MOSFET DRIVER

WITH DEADTIME CONTROL

SLVS224B − NOVEMBER 1999 − REVISED AUGUST 2002

3

POST OFFICE BOX 655303

detailed description

low-side driver

source and sink.

high-side driver

source and sink. The high-side driver can be configured as a ground-reference driver or a floating bootstrap

driver. The internal bootstrap diode is a Schottky for improved drive efficiency. The maximum voltage that can

be applied between the BOOT terminal and ground is 30 V.

dead-time (DT) control

Dead-time control prevents shoot-through current from flowing through the main power FETs during switching

transitions by controlling the turnon times of the MOSFET drivers. The high-side driver is not allowed to turn

on until the gate drive voltage to the low-side FET is low, and the low-side driver is not allowed to turn on until

the voltage at the junction of the power FETs (Vdrain) is low; the TTL-compatible DT terminal connects to the

junction of the power FETs.

IN

The IN terminal is a TTL-compatible digital terminal that is the input control signal for the drivers. The TPS2836

has a noninverting input; the TPS2837 has an inverting input.

−0.3 V to 16 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage range: BOOT to PGND (high-side driver ON)

−0.3 V to 30 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

BOOTLO to PGND

−0.3 V to 16 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

BOOT to BOOTLO

−0.3 V to 16 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

IN

−0.3 V to 16 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DT

−0.3 V to 30 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous total power dissipation

See Dissipation Rating Table

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−40

°C to 125°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds

260

°C

. . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: Unless otherwise specified, all voltages are with respect to PGND.

DISSIPATION RATING TABLE

PACKAGE

TA ≤ 25°C

POWER RATING

DERATING FACTOR

ABOVE TA = 25°C

TA = 70°C

POWER RATING

TA = 85°C

POWER RATING

D

600 mW

6.0 mW/

°C

330 mW

240 mW

recommended operating conditions

MIN

NOM

MAX

UNIT

Supply voltage, VCC

4.5

15

V

Input voltage

BOOT to PGND

4.5

28

V