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NUP4107UPMUTAG Datasheet(PDF) 1 Page - ON Semiconductor |
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NUP4107UPMUTAG Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 3 page © Semiconductor Components Industries, LLC, 2008 November, 2008 − Rev. P0 1 Publication Order Number: NUP4107UPMU/D NUP4107UPMU Product Preview Low Capacitance ESD Protection Array for High Speed Data Line Protection The NUP4107UPMU ESD protection array is designed to protect high speed data lines from ESD. Ultra−low capacitance and high level of ESD protection makes this device well suited for use in USB 2.0 applications. Features • Low Capacitance (< 2 pF Typical Between I/O Lines and Ground) • ESD Rating of Class 3B (Exceeding 8 kV) per Human Body model and Class C (Exceeding 400 V) per Machine Model • Protection for the Following IEC Standards: IEC 61000−4−2 (12 kV Contact) • UL Flammability Rating of 94 V−0 • This is a Pb−Free Device Typical Applications • USB 2.0 Data Line and Power Line Protection • MIDDI Ports • SIM Ports • Gigabit Ethernet • Notebook Computers MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Symbol Value Unit Operating Junction Temperature Range TJ −40 to +125 °C Storage Temperature Range Tstg −55 to +150 °C Lead Solder Temperature − Maximum (10 Seconds) TL 260 °C Human Body Model (HBM) Machine Model (MM) IEC 61000−4−2 Contact (ESD) ESD 16000 400 12000 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice. http://onsemi.com UDFN6 1.6x1.6 MU SUFFIX CASE 517AP Device Package Shipping† ORDERING INFORMATION NUP4107UPMUTAG UDFN6 (Pb−Free) 3000/Tape & Reel 1 3 I/O I/O 2 NC I/O 4 I/O 5 6 VBUS PIN CONNECTIONS †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. XX MG G 1 XX = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) GND MARKING DIAGRAM 1 6 45 6 31 |
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