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PBSS8110X Datasheet(PDF) 4 Page - NXP Semiconductors |
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PBSS8110X Datasheet(HTML) 4 Page - NXP Semiconductors |
4 / 15 page PBSS8110X_2 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 — 11 December 2009 4 of 15 NXP Semiconductors PBSS8110X 100 V, 1 A NPN low VCEsat (BISS) transistor 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6cm2. [3] Device mounted on a ceramic PCB, Al2O3, standard footprint. Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-a) thermal resistance from junction to ambient in free air [1] - - 227 K/W [2] --89 K/W [3] --63 K/W Rth(j-sp) thermal resistance from junction to solder point --16 K/W FR4 PCB; standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse time; typical values 006aaa409 10 1 102 103 Zth(j-a) (K/W) 10−1 10−5 10 10−2 10−4 102 10−1 tp (s) 10−3 103 1 1 0.75 0.5 0.33 0.2 0.1 0.05 0.02 0.01 0 duty cycle = |
Similar Part No. - PBSS8110X_15 |
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Similar Description - PBSS8110X_15 |
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