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MCW406AT Datasheet(PDF) 8 Page - Vishay Siliconix

Part No. MCW406AT
Description  Precision Wide Terminal Thin Film Chip Resistors
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Maker  VISHAY [Vishay Siliconix]
Homepage  http://www.vishay.com
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MCW406AT Datasheet(HTML) 8 Page - Vishay Siliconix

   
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MCW 0406 AT - Precision
www.vishay.com
Vishay Beyschlag
Revision: 22-Jan-15
8
Document Number: 28847
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
DIMENSIONS
SOLDER PAD DIMENSIONS
Note
• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of
power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain
the reliability of the assembly. Specified power rating above 125 °C requires dedicated heat-sink pads, which to a great extend depends on
board materials and design.
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or
in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many
other parameters.
Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation
mode”. Please note however that applications for “power operation mode” require special considerations for the design of solder pads and
adjacent conductor areas.
L
T
b
H
T
t
W
W
T
DIMENSIONS AND MASS
TYPE
H
(mm)
L
(mm)
W
(mm)
WT
(mm)
Tt
(mm)
Tb
(mm)
MASS
(mg)
MCW 0406 AT
0.3 ± 0.05
1.0 ± 0.15
1.5 ± 0.15
> 75 % of W
0.2 + 0.1/- 0.15
0.2 ± 0.1
1.9
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE
REFLOW SOLDERING
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
MCW 0406 AT
0.35
0.55
1.75
1.45
G
X
Y
Z


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