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SG1844 Datasheet(PDF) 2 Page - Microsemi Corporation

Part No. SG1844
Description  CURRENT MODE PWM CONTROLLER
Download  12 Pages
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Maker  MICROSEMI [Microsemi Corporation]
Homepage  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

SG1844 Datasheet(HTML) 2 Page - Microsemi Corporation

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C URRENT -M ODE PWM C ONTROLLER
SG1844/SG1845 Series
PRODUCT DA T ABOOK 1996/1997
Copyright © 2000
Rev. 1.4
4/00
2
P RODUCTION D ATA S HEET
ABSOLUTE MAXIMUM RATINGS
(Notes 1 & 2)
Supply Voltage (I
CC < 30mA) ............................................................... Self Limiting
Supply Voltage (Low Impedance Source) ........................................................ 30V
Output Current (Peak) ....................................................................................... ±1A
Output Current (Continuous) ....................................................................... 350mA
Output Energy (Capacitive Load) ....................................................................... 5µJ
Analog Inputs (Pins 2, 3) ................................................................. -0.3V to +6.3V
Error Amp Output Sink Current ..................................................................... 10mA
Operating Junction Temperature
Hermetic (J, Y, F, L Packages) ................................................................... 150°C
Plastic (N, M, D, DM Packages) ................................................................ 150°C
Storage Temperature Range .......................................................... -65°C to +150°C
Lead Temperature (Soldering, 10 Seconds) .................................................. 300°C
PACKAGE PIN OUTS
V
REF
V
CC
OUT UT
GND
COM
V
FB
I
SENSE
R
T/CT
1
8
27
36
45
M & Y PACKAGE
(Top View)
DM PACKAGE
(Top View)
V
REF
V
CC
OUT UT
GND
COM
V
FB
I
SENSE
R
T/CT
1
8
27
36
45
V
REF
N.C.
V
CC
V
C
OUT UT
GND
WR GND
COM
N.C.
V
FB
N.C.
I
SENSE
N.C.
R
T/CT
1
14
213
312
411
510
69
78
D PACKAGE
(Top View)
M PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
95°C/W
N PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
65°C/W
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
165°C/W
D PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
120°C/W
Y PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
130°C/W
J PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
80°C/W
F PACKAGE:
THERMAL RESISTANCE-JUNCTION TO CASE,
θθθθθ
JC
80°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
145°C/W
L PACKAGE:
THERMAL RESISTANCE-JUNCTION TO CASE,
θθθθθ
JC
35°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
120°C/W
Junction Temperature Calculation: T
J = TA + (PD x θJA).
The
θ
JA numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
THERMAL D ATA
Note 1. Exceeding these ratings could cause damage to the device.
Note 2. All voltages are with respect to Pin 5. All currents are positive into the specified
terminal.
1
14
213
312
411
510
69
78
J & N PACKAGE
(Top View)
COM
N.C.
V
FB
N.C.
I
SENSE
N.C.
R
T/CT
V
REF
N.C.
V
CC
V
C
OUT UT
GROUND
OWER GND
F PACKAGE
(Top View)
10.V
REF
9. V
CC
8. V
C
7. OUT UT
6. GND
1. COM
2. V
FB
3. I
SENSE
4. R
T/CT
5. OWER GND
1
10
29
38
47
56
L PACKAGE
(Top View)
32
4
5
6
7
8
911
10
1. N.C.
2. N.C.
3. COM .
4. N.C.
5. V
FB
6. N.C.
7. I
SENSE
8. R
T/CT
9. N.C.
10. N.C.
120 19
18
17
16
15
14
12 13
11. N.C.
12. WR GND
13. GND
14. N.C.
15. OUT UT
16. N.C.
17. V
C
18. V
CC
19. N.C.
20. V
REF


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