SG1635/SG3635

6/91 Rev 1.1 2/94

Copyright

© 1994

11861 Western Avenue

∞

∞

∞

∞

∞ Garden Grove, CA 92841

2

(714) 898-8121

∞

∞

∞

∞

∞ FAX: (714) 893-2570

Supply Voltage (V

SG1635/SG3635 ............................................................. 40V

Input Voltage

Enable and Pulse .............................................................. 7V

Source/Sink Output Current

Contiuous ........................................................................... 3A

Peak ................................................................................... 5A

Operating Junction Temperature

Hermetic (R - Package) ............................................... 150°C

Plastic (P - Package) ................................................... 150°C

Storage Temperature Range ............................ -65°C to 150°C

Lead Temperature (Soldering, 10 Seconds) .................. 300°C

Supply Voltage (V

SG1635/SG3635 .................................................... 8V to 35V

Source/Sink Output Current

Continuous ......................................................................... 2A

Peak ................................................................................... 3A

Operating Ambient Temperature Range

SG1635 ........................................................... -55°C to 125°C

SG3635 ................................................................ 0°C to 70°C

Note 2. Range over which the device is functiona

l.

ELECTRICAL CHARACTERISTICS

SG1635/SG3635

Parameter

Test Conditions

SG1635 and SG3635

(Unless otherwise specified, these specfiications apply over the operating ambient temperatures for SG1635 with -55

°C ≤ T

0

°C ≤ T

temperature.)

V

V

V

V

V

V

V

I

V

V

V

Logic 1 Input Voltage

Logic 0 Input Voltage

Input High Current

Input Low Current

Output Leakage

Source Saturation Voltage

Sink Saturation Voltage

Diode Forward Voltage

Supply Current

Static Characteristics

2.0

V

V

µA

mA

mA

mA

V

V

V

mA

mA

2.0

2.0

2.0

Min.

Typ. Max.

Units

0.8

200

-3.2

500

40

3.0

3.0

3.0

25

70

Note 1. Values beyond which damage may occur.

θθθθθ

THERMAL DATA

R Package:

θ

5.0°C/W

θ

P Package:

θ

θ

55°C/W

Note A. Junction Temperature Calculation: T

Note B. The above numbers for

θ

thermal resistance of the package in a standard mount-

ing configuration. The

θ

guidelines for the thermal performance of the device/pc-

board system. All of the above assume no ambient

airflow.