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NSBC144EPDXV6T1G Datasheet(PDF) 8 Page - ON Semiconductor |
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NSBC144EPDXV6T1G Datasheet(HTML) 8 Page - ON Semiconductor |
8 / 10 page MUN5313DW1, SMUN5313DW1, NSBC144EPDXV6, NSBC144EPDP6 http://onsemi.com 8 PACKAGE DIMENSIONS SC−88/SC70−6/SOT−363 CASE 419B−02 ISSUE W NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419B−01 OBSOLETE, NEW STANDARD 419B−02. E 0.2 (0.008) MM 12 3 D e A1 A A3 C L 65 4 −E− b 6 PL DIM MIN NOM MAX MILLIMETERS A 0.80 0.95 1.10 A1 0.00 0.05 0.10 A3 b 0.10 0.21 0.30 C 0.10 0.14 0.25 D 1.80 2.00 2.20 0.031 0.037 0.043 0.000 0.002 0.004 0.004 0.008 0.012 0.004 0.005 0.010 0.070 0.078 0.086 MIN NOM MAX INCHES 0.20 REF 0.008 REF HE HE E 1.15 1.25 1.35 e 0.65 BSC L 0.10 0.20 0.30 2.00 2.10 2.20 0.045 0.049 0.053 0.026 BSC 0.004 0.008 0.012 0.078 0.082 0.086 mm inches SCALE 20:1 0.65 0.025 0.65 0.025 0.50 0.0197 0.40 0.0157 1.9 0.0748 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* SC−88/SC70−6/SOT−363 |
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