NOP04811

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10

PACKAGE DIMENSIONS

OLCC12 20x5, 3.0P

CASE 755AA

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION A INCLUDES THE PACKAGE BODY AND LID BUT DOES

NOT INCLUDE HEATSINKS OR OTHER ATTACHED FEATURES.

4. THE GLASS LID DEFINED BY DIMENSIONS D2 AND E2 MUST BE

LOCATED WITHIN DIMENSIONS D AND E.

5. PIN ONE INDICATOR SHALL BE AS SHOWN IN THIS LOCATION.

DIM

A

MIN

MAX

MILLIMETERS

1.37

1.77

A2

0.50 REF

b

0.75

0.85

D2

19.00 REF

D

19.90

20.10

E2

4.00 REF

4.90

5.10

E

e

3.00 BSC

1.15

1.25

L

DETAIL A

NOTE 5

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

RECOMMENDED

0.10

0.20

L1

A1

1.00 REF

3.00

1.58

12X

DIMENSIONS: MILLIMETERS

0.80

PITCH

5.30

12X

1

PACKAGE

OUTLINE

D

E

NOTE 4

DETAIL A

GLASS

LID

TOP VIEW

B

A

SEATING

PLANE

A2

A

A1

0.08 C

NOTE 3

SIDE VIEW

C

L

e

b

6

7

12X

1

12

12X

BOTTOM VIEW

NOTE 4

D2

E2

L1

12X

e/2

S

B

M

0.05

C

S

A

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