CAT6500

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4

Table 2. ABSOLUTE MAXIMUM RATINGS

Parameter

Symbol

Pin

Range

Unit

Input Voltage Range (Note 1)

PS1, PS2

−5.0 to 18

V

VCC, C1, PWR_OUT

−0.3 to 6.0

Control Logic Input Range

RM_ENx, PRIORITY

−0.3 to 6.0

V

Control Logic Output Range

SW1_STAT, SW2_STAT

−0.3 to 6.0

V

Maximum Junction Temperature

–

150

°C

Storage Temperature Range

–

−65 to 150

°C

ESD Capability, Human Body Model (Note 2)

ALL

2

kV

ESD Capability, Machine Model (Note 2)

ALL

200

V

Lead Temperature Soldering

Reflow (SMD Styles Only), Pb−Free Versions (Note 3)

ALL

260

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.

2. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)

ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)

Latchup Current Maximum Rating:

≤ 150 mA per JEDEC standard: JESD78

3. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D

Parameter

Symbol

Value

Unit

Thermal Characteristics, TDFN−32 4.4 x 4.4 mm

Thermal Resistance, Junction−to−Air, 1 sq. Inch, 1 oz. Copper Clad PCB

Thermal Resistance, Junction−to−Air, 1 sq. Inch, 2 oz. Copper Clad PCB

59

54

°C/W

Table 4. RECOMMENDED OPERATING CONDITIONS

Parameter

Symbol

Min

Max

Unit

Input Voltage PS1, PS2

1.6

5.5

V

0

5.5

−5

7.7

Output Current

0

3.3

A

Control Logic; Inputs and Outputs

0

5.5

V

Ambient Temperature

−40

+85

°C

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.