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C1608X5R0J106M Datasheet(PDF) 2 Page - ON Semiconductor |
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C1608X5R0J106M Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 16 page NCP6323, NCV6323 www.onsemi.com 2 1uH Vo = 0.6V to Vin Cout 10uF PGND FB PVIN EN SW AGND AVIN PG Cin 10uF Rpg 1M Vin = 2.5 V to 5.5 V Power Good Enable R1 R2 Cfb NCP/NCV6323 (a) Power Good Output Option (NCP/NCV6323) Figure 1. Typical Application Circuit PIN DESCRIPTION Pin Name Type Description 1 PGND Power Ground Power Ground for power, analog blocks. Must be connected to the system ground. 2 SW Power Output Switch Power pin connects power transistors to one end of the inductor. 3 AGND Analog Ground Analog Ground analog and digital blocks. Must be connected to the system ground. 4 FB Analog Input Feedback Voltage from the buck converter output. This is the input to the error amplifier. This pin is connected to the resistor divider network between the output and AGND. 5 EN Digital Input Enable of the IC. High level at this pin enables the device. Low level at this pin disables the de- vice. 6 PG Digital Output It is open drain output. Low level at this pin indicates the device is not in power good, while high impedance at this pin indicates the device is in power good. 7 AVIN Analog Input Analog Supply. This pin is the analog and the digital supply of the device. An optional 1 mF or lar- ger ceramic capacitor bypasses this input to the ground. This capacitor should be placed as close as possible to this input. 8 PVIN Power Input Power Supply Input. This pin is the power supply of the device. A 10 mF or larger ceramic capacit- or must bypass this input to the ground. This capacitor should be placed as close a possible to this input. 9 PAD Exposed Pad Exposed Pad. Must be soldered to system ground to achieve power dissipation performances. This pin is internally unconnected ORDERING INFORMATION Device Marking Package Shipping† NCP6323DMTAATBG NN WDFN8 (Pb−Free) 3000 / Tape & Reel NCV6323BMTAATBG 23 WDFN8 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. |
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