LM4121

www.ti.com

SNVS073C – APRIL 2000 – REVISED APRIL 2013

Operating Range

(1)

Storage Temperature Range

−65°C to +150°C

Ambient Temperature Range

−40°C to +85°C

Junction Temperature Range

−40°C to +125°C

(1)

“Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test

conditions, see Electrical Characteristics - LM4121-1.250V and Electrical Characteristics - LM4121-ADJ tables. The ensured

specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated

under the listed test conditions.

Electrical Characteristics

LM4121-1.250V

25°C, and limits in boldface type apply over the

Symbol

Parameter

Conditions

Units

Output Voltage Initial

Accuracy

1.250

±0.2

%

LM4121A-1.250

LM4121-1.250

±0.5

Temperature

14

50

ppm/°c

Coefficient

Line Regulation

1.8V

0.0007

0.009

%/V

0.012

0 mA

0.03

0.08

0.17

1 mA

0.01

0.04

Load Regulation

%/mA

0.1

0.04

0.12

0.01

Minimum Operating

1.5

1.8

V

Voltage

Output Noise Voltage

0.1 Hz to 10 Hz

20

10 Hz to 10 kHz

30

Supply Current

160

250

µA

275

Power-down Supply

Current

Enable = 0.4V

1

µA

Enable = 0.2V

2

Logic High Input

1.6

1.5

V

Voltage

Logic Low Input

0.4

V

Voltage

0.2

Logic High Input

7

15

µA

Current

Logic Low Input

0.1

µA

Current

15

6

30

Short Circuit Current

mA

17

6

30

Hyst

Thermal Hysteresis

0.5

mV/V

(3)

(1)

Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical

Quality Control (SQC) methods. The limits are used to calculate TI's Averaging Outgoing Quality Level (AOQL).

(2)

Typical numbers are at 25°C and represent the most likely parametric norm.

(3)

Thermal hysteresis is defined as the change in +25°C output voltage before and after exposing the device to temperature extremes.

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