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LC450029PKB Datasheet(PDF) 2 Page - ON Semiconductor |
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LC450029PKB Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 25 page LC450029PKB No.A1916-2/25 Specifications Absolute Maximum Ratings at Ta = 25 °C, VSS = 0V Parameter Symbol Conditions Ratings Unit Maximum supply voltage VDD max, VDDI max VDD=VDDI -0.3 to +6.5 V VIN1 CE, CL, DI, INH -0.3 to +6.5 Input voltage VIN2 OSCI -0.3 to VDDI+0.3 V Output voltage VOUT S1 to S53, COM1 to COM4 -0.3 to VDD+0.3 V IOUT1 S1 to S53 300 μA Output current IOUT2 COM1 to COM4 3 mA Operating temperature Topr -40 to +105 °C Storage temperature Tstg -55 to +125 °C (Note) Power supply pads (VDD, VDDI) should connect all pads to the same power supply. (See sample applications circuits) Allowable Operating Ranges at Ta = -40 to +105 °C, VSS = 0V Ratings Parameter Symbol Conditions min typ max Unit Supply voltage VDD, VDDI VDD=VDDI 4.5 6.0 V VIH1 CE, CL, DI, INH 0.8VDD 6.0 Input high-level voltage VIH2 OSCI: External clock operating mode 0.8VDD VDDI V VIL1 CE, CL, DI, INH 0 0.2VDDI Input low-level voltage VIL2 OSCI: External clock operating mode 0 0.2VDDI V External clock operating frequency fCK OSCI: External clock operating mode [Figure 4] 10 300 600 kHz External clock duty cycle DCK OSCI: External clock operating mode [Figure 4] 30 50 70 % Data setup time tds CL, DI [Figure 2][Figure 3] 160 ns Data hold time tdh CL, DI [Figure 2][Figure 3] 160 ns CE wait time tcp CE, CL [Figure 2][Figure 3] 160 ns CE setup time tcs CE, CL [Figure 2][Figure 3] 160 ns CE hold time tch CE, CL [Figure 2][Figure 3] 160 ns High-level clock pulse width t φH CL [Figure 2][Figure 3] 160 ns Low-level clock pulse width t φL CL [Figure 2][Figure 3] 160 ns Rise time tr CE, CL, DI [Figure 2][Figure 3] 160 ns Fall time tf CE, CL, DI [Figure 2][Figure 3] 160 ns INH switching time tc INH, CE [Figure 5][Figure 6] 10 μs (Note) Power supply pads (VDD, VDDI) should connect all pads to the same power supply. (See sample applications circuits) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. |
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