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MT55L512L18P Datasheet(PDF) 29 Page - Micron Technology

Part No. MT55L512L18P
Description  8Mb ZBT SRAM
Download  30 Pages
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Maker  MICRON [Micron Technology]
Homepage  http://www.micron.com
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MT55L512L18P Datasheet(HTML) 29 Page - Micron Technology

 
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8Mb: 512K x 18, 256K x 32/36 Pipelined ZBT SRAM
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT55L512L18P_2.p65 – Rev. 6/01
©2001, Micron Technology, Inc.
8Mb: 512K x 18, 256K x 32/36
PIPELINED ZBT SRAM
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micronsemi.com, Customer Comment Line: 800-932-4992
Micron is a registered trademark of Micron Technology, Inc.
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc.,
and the architecture is supported by Micron Technology, Inc., and Motorola Inc.
Ø
7.62
20.32
19.94 ±0.10
11.94 ±0.10
1.27 (TYP)
1.27 (TYP)
0.60 ±0.10
2.40 MAX
0.90 ±0.10
14.00 ±0.10
22.00 ±0.20
A1 CORNER
A1 CORNER
(dimension applies to a
noncollapsed solder ball)
Substrate material:
BT resin laminate
0.15
SEATING PLANE
0.75 ±0.15
NOTE: 1. All dimensions in millimeters MAX or typical where noted.
MIN
2. Solder ball land pad is 0.6mm.
119-PIN BGA


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