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MT55L512L18P Datasheet(PDF) 11 Page - Micron Technology

Part No. MT55L512L18P
Description  8Mb ZBT SRAM
Download  30 Pages
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Maker  MICRON [Micron Technology]
Homepage  http://www.micron.com
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MT55L512L18P Datasheet(HTML) 11 Page - Micron Technology

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8Mb: 512K x 18, 256K x 32/36 Pipelined ZBT SRAM
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT55L512L18P_2.p65 – Rev. 6/01
©2001, Micron Technology, Inc.
8Mb: 512K x 18, 256K x 32/36
PIPELINED ZBT SRAM
x18
x32/x36
SYMBOL
TYPE
DESCRIPTION
4C, 4N, 5C,
4C, 4N, 5C,
VSS
Supply Ground: GND.
5D, 5E, 5F, 5G, 5D, 5E, 5F, 5G,
5H, 5J, 5K, 5L, 5H, 5J, 5K, 5L,
5M, 6C, 6D,
5M, 6C, 6D,
6E, 6F, 6G, 6H, 6E, 6F, 6G, 6H,
6J, 6K, 6L, 6M, 6J, 6K, 6L, 6M,
7C, 7D, 7E, 7F, 7C, 7D, 7E, 7F,
7G, 7H, 7J, 7K, 7G, 7H, 7J, 7K,
7L, 7M, 8C, 8N 7L, 7M, 8C, 8N
5P, 7P, 5R, 7R 5P, 7P, 5R, 7R
DNU
Do Not Use: These signals may either be unconnected or wired to
GND to improve package heat dissipation.
1A, 1B, 1C, 1D,
1A, 1B, 1P,
NC
No Connect: These signals are not internally connected and may be
1E, 1F, 1G,
2C, 2N, 2P,
connected to ground to improve package heat dissipation.
1P, 2C, 2J, 2K, 2R, 3H, 5N,
Pin 9B is reserved for address pin expansion; 16MB.
2L, 2M, 2N,
6N, 9B, 9H,
2P, 2R, 3H, 4B, 10C, 10H, 10N,
5A, 5N, 6N,
11A, 11B, 11P
9B, 9H, 10C,
10D, 10E, 10F,
10G, 10H, 10N,
11B, 11J, 11K,
11L, 11M,
11N, 11P
NF
No Function: These pins are internally connected to the die and
have the capacitance of an input pin. It is allowable to leave
these pins unconnected or driven by signals.
FBGA PIN DESCRIPTIONS (CONTINUED)


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