CM1214

http://onsemi.com

7

PACKAGE DIMENSIONS

SOT−23 3−Lead (TO−236AA)

CASE 419AH−01

ISSUE O

D

A1

3

12

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH

THICKNESS. MINIMUM LEAD THICKNESS IS THE

MINIMUM THICKNESS OF BASE MATERIAL.

4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS, OR GATE BURRS. MOLD

FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT

EXCEED 0.15 PER SIDE. DIMENSIONS D AND E1 ARE

DETERMINED AT DATUM H.

5. PIN ONE INDICATOR MUST BE LOCATED IN THE IN-

DICATED ZONE.

DETAIL Z

L

L2

e

E1

E

b

A

DETAIL Z

DIM

A

MIN

MAX

MILLIMETERS

0.75

1.17

A1

0.05

0.15

b

0.30

0.50

c

0.08

0.20

D

2.80

3.05

E1

1.20

1.40

e

L

0.40

0.60

2.10

2.64

E

c

08

M

°

°

0.95 BSC

L2

0.25 BSC

2.74

0.95

PITCH

DIMENSIONS: MILLIMETERS

0.82

3X

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

RECOMMENDED

0.56

3X

3X

PLANE

0.05

M

PLANE

GAUGE

PLANE

e