LMZ31506H

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SNVS996 – JULY 2013

THERMAL INFORMATION

LMZ31506H

RUQ47

UNITS

47 PINS

13

9

6

°C/W

2.5

5

3.8

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3)

The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(5)

The junction-to-top characterization parameter,

from the simulation data for obtaining

(6)

The junction-to-board characterization parameter,

from the simulation data for obtaining

(7)

The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific

JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

Spacer

PACKAGE SPECIFICATIONS

LMZ31506H

UNIT

Weight

1.26 grams

Flammability

Meets UL 94 V-O

MTBF Calculated reliability

33.9 MHrs

Copyright © 2013, Texas Instruments Incorporated

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