TDI-CCD area image sensor

S7199-01/-01F

www.hamamatsu.com

Image sensor with a long, narrow photosen-

sitive area for X-ray imaging

1

1536 × 128 pixel (× 2 chips)

General X-ray imaging

Buttable structure of 2 chips

Non-destructive inspection

TDI (time delay integration) operation

Dental panorama

100% fill factor

Wide dynamic range

Low dark current

Low readout noise

MPP operation

Pixel size: 48 × 48 μm

Specifications

Parameter

S7199-01

S7199-01F

CCD structure

Full frame transfer or TDI

Window

FOS (fiber optic plate with scintillator)

Photosensitive area (H × V)

73.728 × 6.144 mm (× 2 chips)

X-ray sensitive area

146 × 6 mm

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Pixel size (H × V)

48 × 48 μm

Number of total pixels (H × V)

1536 × 128 (× 2 chips)

Number of effective pixels (H × V)

1536 × 128 (× 2 chips)

Fill factor

100%

Vertical clock phase

2 phases

Horizontal clock phase

2 phases

Output circuit

Two-stage MOSFET source follower with load resistance

X-ray resolution

4 to 6 Lp/mm at 60 kVp, 20 μGy

-

Total dose irradiation

50 Gy max.

-

Package

40-pin ceramic

Cooling

Non-cooled

*1: When using this product for X-ray detection, the user needs to affix a phosphor sheet, etc. to the FOP.

The S7199-01 is a front-illuminated FFT-CCD image sensor developed for X-ray imaging. An FOS (Fiber Optic plate with

Scintillator) sensitive to X-rays is directly coupled to the CCD chips, allowing X-ray imaging with high sensitivity. Two CCD

chips are arranged in close proximity to configure a long photosensitive area (approx. 150 mm).

The S7199-01 CCD image sensor features TDI mode operation that allows capturing clear, sharp X-ray images of objects

moving on a belt conveyor, making it ideal for non-destructive X-ray inspection. FOP type not coated with scintillator mate-

rial is also provided (S7199-01F).

Features

Applications