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SIHFZ48L Datasheet(PDF) 1 Page - Vishay Telefunken |
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SIHFZ48L Datasheet(HTML) 1 Page - Vishay Telefunken |
1 / 9 page IRFZ48S, IRFZ48L, SiHFZ48S, SiHFZ48L www.vishay.com Vishay Siliconix S15-1659-Rev. D, 20-Jul-15 1 Document Number: 90377 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Power MOSFET FEATURES • Advanced process technology • Surface mount (IRFZ48S, SiHFZ48S) • Low-profile through-hole (IRFZ48L, SiHFZ48L) • 175 °C operating temperature •Fast switching • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 Note * This datasheet provides information about parts that are RoHS-compliant and / or parts that are non-RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details. DESCRIPTION Third generation power MOSFETs from Vishay utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The D2PAK is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2PAK is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2 W in a typical surface mount application. The through-hole version (IRFZ48L, SiHFZ48L) is available for low-profile applications. Note a. See device orientation. Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. VDD = 25 V, Starting TJ = 25 °C, L = 22 μH, Rg = 25 , IAS = 72 A (see fig. 12). c. ISD 72 A, dI/dt 200 A/μs, VDD VDS, TJ 175 °C. d. 1.6 mm from case. e. Uses IRFZ48, SiHFZ48 data and test conditions. f. Calculated continuous current based on maximum allowable junction temperature. PRODUCT SUMMARY VDS (V) 60 RDS(on) ()VGS = 10 V 0.018 Qg (Max.) (nC) 110 Qgs (nC) 29 Qgd (nC) 36 Configuration Single N-Channel MOSFET G D S D2PAK (TO-263) G D S I2PAK (TO-262) G D S Available Available ORDERING INFORMATION Package D2PAK (TO-263) I2PAK (TO-262) Lead (Pb)-free and halogen-free SiHFZ48S-GE3 SiHFZ48L-GE3 Lead (Pb)-free IRFZ48SPbF - ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted) PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage VDS 60 V Gate-Source Voltage VGS ± 20 Continuous Drain Current f VGS at 10 V TC = 25 °C ID 50 A TC = 100 °C 50 Pulsed Drain Current a, e IDM 290 Linear Derating Factor 1.3 W/°C Single Pulse Avalanche Energy b, e EAS 100 mJ Maximum Power Dissipation TC = 25 °C PD 190 W TA = 25 °C 3.7 Peak Diode Recovery dV/dt c, e dV/dt 4.5 V/ns Operating Junction and Storage Temperature Range TJ, Tstg -55 to +175 °C Soldering Recommendations (Peak temperature) d for 10 s 300 |
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