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PDS_BP-100 Datasheet(PDF) 1 Page - List of Unclassifed Manufacturers

Part No. PDS_BP-100
Description  Thermally Conductive, Fiberglass Reinforced Pressure Sensitive Adhesive Tape
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PDS_BP-100 Datasheet(HTML) 1 Page - List of Unclassifed Manufacturers

   
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Shelf Life: The double-sided, pressure
sensitive adhesive used in Bond-Ply®
products requires the use of dual liners to
protect the surfaces from contaminants.
The recommended shelf life for Bergquist
Bond-Ply® 100 is 6-months at a maximum
continuous storage temperature of 35°C
or 3-months at a maximum continuous
storage temperature of 45°C, for
maintenance of controlled adhesion to the
liner. The shelf life of the Bond-Ply®
material, without consideration of liner
adhesion (which is often not critical for
manual assembly processing), is
recommended at 12 months from date of
manufacture at a maximum continuous
storage temperature of 60°C.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
Bond-Ply® 100
TYPICAL APPLICATIONS INCLUDE
• Mount heat sink onto BGA graphic processor or drive processor
• Mount heat spreader onto power converter PCB or onto motor control PCB
CONFIGURATIONS AVAILABLE
• Sheet form, roll form and die-cut parts
PDS_BP_100_July 2014
FEATURES AND BENEFITS
• Thermal impedance: 0.52°C-in2/W
(@50 psi)
• High bond strength to a variety of surfaces
• Double-sided, pressure sensitive
adhesive tape
• High performance, thermally conductive
acrylic adhesive
• Can be used instead of heat-cure
adhesive, screw mounting or
clip mounting
PRODUCT DESCRIPTION
Thermally Conductive, Fiberglass Reinforced
Pressure Sensitive Adhesive Tape
July 2014
PROPERTY
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Color
White
White
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
Thickness (inch) / (mm)
0.005, 0.008, 0.011 0.127, 0.203, 0.279
ASTM D374
Temp. Resistance, 30 sec. (°F) / (°C)
392
200
Elongation (%45° to Warp & Fill)
70
70
ASTM D412
Tensile Strength (psi) / (MPa)
900
6
ASTM D412
CTE (ppm)
325
325
ASTM D3386
Glass Transition (°F) / (°C)
-22
-30
ASTM D1356
Continuous Use Temp (°F) / (°C)
-22 to 248
-30 to 120
ADHESION
Lap Shear @ RT (psi) / (MPa)
100
0.7
ASTM D1002
Lap Shear after 5 hr @ 100°C
200
1.4
ASTM D1002
Lap Shear after 2 min @ 200°C
200
1.4
ASTM D1002
Static Dead Weight Shear (°F) / (°C)
302
150
PSTC#7
ELECTRICAL
VALUE
TEST METHOD
Dielectric Breakdown Voltage - 0.005" (Vac)
3000
ASTM D149
Dielectric Breakdown Voltage - 0.008" (Vac)
6000
ASTM D149
Dielectric Breakdown Voltage - 0.011" (Vac)
8500
ASTM D149
Flame Rating
V-O
U.L.94
THERMAL
Thermal Conductivity (W/m-K)
0.8
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Initial Assembly Pressure (psi for 5 seconds)
10
25
50
100
200
TO-220 Thermal Performance (°C/W) 0.005"
5.17
4.87
4.49
4.18
4.10
TO-220 Thermal Performance (°C/W) 0.008"
5.40
5.35
5.28
5.22
5.20
TO-220 Thermal Performance (°C/W) 0.011"
6.59
6.51
6.51
6.50
6.40
Thermal Impedance (°C-in2/W) 0.005" (1)
0.56
0.54
0.52
0.50
0.50
Thermal Impedance (°C-in2/W) 0.008" (1)
0.82
0.80
0.78
0.77
0.75
Thermal Impedance (°C-in2/W) 0.011" (1)
1.03
1.02
1.01
1.00
0.99
1) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
TYPICAL PROPERTIES OF BOND-PLY 100


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