film which has high thermal conductivity,

high dielectric strength and is very durable.

properties of well-known Sil-Pad rubber

with the physical properties of a film.

withstands high voltages and requires no

thermal grease to transfer heat.

shapes and sizes.

Note: To build a part number, visit our

website at www.bergquistcompany.com.

TYPICAL APPLICATIONS INCLUDE

• Power supplies

• Motor controls

• Power semiconductors

CONFIGURATIONS AVAILABLE

• Sheet form, die-cut parts and roll form

• With or without pressure sensitive adhesive

PDS_SP_K4_1113

FEATURES AND BENEFITS

(@50 psi)

• Withstands high voltages

• High dielectric strength

• Very durable

PRODUCT DESCRIPTION

The Original Polyimide-Based Insulator

November 2013

PROPERTY

IMPERIAL VALUE

METRIC VALUE

TEST METHOD

Color

Gray

Gray

Visual

Reinforcement Carrier

Polyimide

Polyimide

—

Thickness (inch) / (mm)

0.006

0.152

ASTM D374

Hardness (Shore A)

90

90

ASTM D2240

Breaking Strength (lbs/inch) / (kN/m)

30

5ASTM D1458

Elongation (%)

40

40

ASTM D412

Tensile Strength (psi) / (MPa)

5000

34

ASTM D412

Continuous Use Temp (°F) / (°C)

-76 to 356

-60 to 180

—

ELECTRICAL

Dielectric Breakdown Voltage (Vac)

6000

6000

ASTM D149

Dielectric Constant (1000 Hz)

5.0

5.0

ASTM D150

Volume Resistivity (Ohm-meter)

ASTM D257

Flame Rating

VTM-O

VTM-O

U.L.94

THERMAL

Thermal Conductivity (W/m-K)

0.9

0.9ASTM D5470

THERMAL PERFORMANCE vs PRESSURE

Pressure (psi)

10

25

50

100

200

TO-220 Thermal Performance (°C/W)

3.66

3.43

3.13

2.74

2.42

1.07

0.68

0.48

0.42

0.38

1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for

reference only. Actual application performance is directly related to the surface roughness,flatness and pressure applied.

TYPICAL PROPERTIES OF SIL-PAD K-4