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SHT20P Datasheet(PDF) 3 Page - List of Unclassifed Manufacturers

Part No. SHT20P
Description  DFN type package reflow solderable
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Maker  ETC2 [List of Unclassifed Manufacturers]
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SHT20P Datasheet(HTML) 3 Page - List of Unclassifed Manufacturers

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www.sensirion.com
Version 4 – May 2014
3/10
Users Guide SHT20P
1 Extended Specifications
For details on how Sensirion is specifying and testing
accuracy performance please consult Application Note
“Statement on Sensor Specification”.
1.1
Operating Range
The sensor works stable within recommended Normal
Range – see Figure 4. Long term exposure to conditions
outside Normal Range, especially at humidity >80%RH,
may temporarily offset the RH signal (+3%RH after 60h).
After return into the Normal Range it will slowly return
towards calibration state by itself. Prolonged exposure to
extreme conditions may accelerate ageing.
Figure 4 Operating Conditions
1.2
RH accuracy at various temperatures
Typical RH accuracy at 25°C is defined in Figure 2. For
other temperatures, typical accuracy has been evaluated
to be as displayed in Figure 5.
.
Figure 5 Typical accuracy of relative humidity measurements
given in %RH for temperatures 0 – 80°C.
2 Application Information
2.1
Soldering Instructions
The DFN’s die pad (centre pad) and perimeter I/O pads
are fabricated from a planar copper lead-frame by over-
molding leaving the die pad and I/O pads exposed for
mechanical and electrical connection. Both the I/O pads
and die pad should be soldered to the PCB. In order to
prevent oxidation and optimize soldering, the bottom side
of the sensor pads is plated with Ni/Pd/Au.
On the PCB the I/O lands8 should be 0.2mm longer than
the package I/O pads. Inward corners may be rounded to
match the I/O pad shape. The I/O land width should match
the DFN-package I/O-pads width 1:1 and the land for the
die pad should match 1:1 with the DFN package – see
Figure 6.
The solder mask9 design for the land pattern preferably is
of type Non-Solder Mask Defined (NSMD) with solder
mask openings larger than metal pads. For NSMD pads,
the solder mask opening should be about 120μm to
150μm larger than the pad size, providing a 60μm to 75μm
design clearance between the copper pad and solder
mask. Rounded portions of package pads should have a
matching rounded solder mask-opening shape to minimize
the risk of solder bridging. For the actual pad dimensions,
each pad on the PCB should have its own solder mask
opening with a web of solder mask between adjacent
pads.
Figure 6 Recommended metal land pattern for SHT2x. Values
in mm. Die pad (centre pad) may be left floating or be connected
to ground, NC pads shall be left floating. The outer dotted line
represents the outer dimension of the DFN package.
For solder paste printing a laser-cut, stainless steel stencil
with electro-polished trapezoidal walls and with 0.125mm
stencil thickness is recommended. For the I/O pads the
8 The land pattern is understood to be the metal layer on the PCB, onto which
the DFN pads are soldered to.
9 The solder mask is understood to be the insulating layer on top of the PCB
covering the connecting lines.
100 ±4.5 ±4
±4
±4
±4
±4 ±4.5 ±5
±5
90 ±4.5 ±4 ±3.5 ±3.5 ±3.5 ±3.5 ±4 ±4.5 ±5
80
±4 ±3.5 ±3
±3
±3 ±3.5 ±3.5 ±4 ±4.5
70
±4 ±3.5 ±3
±3
±3
±3 ±3.5 ±3.5 ±4
60 ±3.5 ±3
±3
±3
±3
±3
±3 ±3.5 ±3.5
50 ±3.5 ±3
±3
±3
±3
±3
±3
±3 ±3.5
40 ±3.5 ±3
±3
±3
±3
±3
±3
±3
±3
30 ±3.5 ±3
±3
±3
±3
±3
±3
±3
±3
20 ±3.5 ±3.5 ±3
±3
±3
±3
±3
±3
±3
10
±4
±4 ±3.5 ±3.5 ±3.5 ±3.5 ±3.5 ±3.5 ±3.5
0 ±4.5 ±4.5 ±4
±4
±4
±4
±4
±4
±4
0
10
20
30
40
50
60
70
80
Temperature [°C]
0
10
20
30
40
50
60
70
80
90
100
-40
-20
0
20
40
60
80
100
120
Temperature (°C)
Max.
Range
Normal
Range
1.0
1.0
0.3
0.4
2.4


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