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SIS452DN Datasheet(PDF) 1 Page - Vishay Telefunken

Part # SIS452DN
Description  N-Channel 12-V (D-S) MOSFET
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Manufacturer  TFUNK [Vishay Telefunken]
Direct Link  http://www.vishay.com
Logo TFUNK - Vishay Telefunken

SIS452DN Datasheet(HTML) 1 Page - Vishay Telefunken

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Vishay Siliconix
SiS452DN
New Product
Document Number: 65705
S10-0215-Rev. A, 25-Jan-10
www.vishay.com
1
N-Channel 12-V (D-S) MOSFET
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
TrenchFET® Power MOSFET
100 % Rg Tested
100 % UIS Tested
Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
POL
DC/DC
PRODUCT SUMMARY
VDS (V)
RDS(on) (Ω)
ID (A)
a
Qg (Typ.)
12
0.00325 at VGS = 10 V
35
13.5 nC
0.0048 at VGS = 4.5 V
35
Ordering Information: SiS452DN-T1-GE3 (Lead (Pb)-free and Halogen-free)
1
2
3
4
5
6
7
8
S
S
S
G
D
D
D
D
3.30 mm
3.30 mm
PowerPAK® 1212-8
Bottom View
N-Channel MOSFET
G
D
S
Notes:
a. Package Limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See Solder Profile (
www.vishay.com/ppg?73257). The PowerPAK 1212 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 81 °C/W.
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
VDS
12
V
Gate-Source Voltage
VGS
± 20
Continuous Drain Current (TJ = 150 °C)
TC = 25 °C
ID
35a
A
TC = 70 °C
35a
TA = 25 °C
27.9b, c
TA = 70 °C
22.3b, c
Pulsed Drain Current
IDM
100
Avalanche Current
L = 0.1 mH
IAS
30
Avalanche Energy
EAS
45
mJ
Continuous Source-Drain Diode Current
TC = 25 °C
IS
35a
A
TA = 25 °C
3.2b, c
Maximum Power Dissipation
TC = 25 °C
PD
52
W
TC = 70 °C
33
TA = 25 °C
3.8b, c
TA = 70 °C
2b, c
Operating Junction and Storage Temperature Range
TJ, Tstg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)d, e
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambientb, f
t
≤ 10 s
RthJA
24
33
°C/W
Maximum Junction-to-Case (Drain)
Steady State
RthJC
1.9
2.4


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