SI8802DB datasheet(7/8 Pages) TFUNK

Part #	SI8802DB

Description	N-Channel 8 V (D-S) MOSFET

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Manufacturer	TFUNK [Vishay Telefunken]

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Vishay Siliconix

Revision: 16-Feb-15

1

Document Number: 69442

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

MICRO FOOT®: 4-Bump (0.8 mm x 0.8 mm, 0.4 mm Pitch)

Notes

(1) Laser mark on the backside surface of die

(2) Bumps are 95.5 % Sn,3.8 % Ag,0.7 % Cu

(3) “i” is the location of pin 1

(4) “b1” is the diameter of the solderable substrate surface, defined by an opening in the solder resist layer solder mask defined.

(5) Non-solder mask defined copper landing pad.

Note

a. Use millimeters as the primary measurement.

DIM.

MILLIMETERS a

INCHES

MIN.

NOM.

MAX.

MIN.

NOM.

MAX.

A

0.328

0.365

0.402

0.0129

0.0144

0.0158

A1

0.136

0.160

0.184

0.0053

0.0062

0.0072

A2

0.192

0.205

0.218

0.0076

0.0081

0.0086

b

0.200

0.220

0.240

0.0078

0.0086

0.0094

b1

0.175

0.0068

e

0.400

0.0157

S

0.160

0.180

0.200

0.0062

0.0070

0.0078

D

0.720

0.760

0.800

0.0283

0.0299

0.0314

K

0.040

0.070

0.100

0.0015

0.0027

0.0039

XXX

AK

Mark on Backside of die

D

S

e

S

4x Ø b

S

G

D

Note 4

Bump Note 2

b

k

e

4-Ø 0.205 to 0.225 Note 5

Solder Mask ~Ø 0.215

b1

ECN: T15-0053-Rev. A, 16-Feb-15

DWG: 6033

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