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SI7234DP Datasheet(PDF) 9 Page - Vishay Telefunken

Part No. SI7234DP
Description  Dual N-Channel 12-V (D-S) MOSFET
Download  13 Pages
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Manufacturer  TFUNK [Vishay Telefunken]
Direct Link  http://www.vishay.com
Logo TFUNK - Vishay Telefunken

SI7234DP Datasheet(HTML) 9 Page - Vishay Telefunken

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PowerPAK® SO-8 Mounting and Thermal Considerations
Application Note AN821
www.vishay.com
Vishay Siliconix
Revision: 16-Mai-13
2
Document Number: 71622
For technical questions, contact: powermosfettechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PowerPAK SO-8 DUAL
The pin arrangement (drain, source, gate pins) and the pin
dimensions of the PowerPAK SO-8 dual are the same as
standard SO-8 dual devices. Therefore, the PowerPAK
device connection pads match directly to those of the SO-8.
As in the single-channel package, the only exception is the
extended drain connection area. Manufacturers can likewise
take immediate advantage of the PowerPAK SO-8 dual
devices by mounting them to existing SO-8 dual land
patterns.
To take the advantage of the dual PowerPAK SO-8’s
thermal performance, the minimum recommended land
pattern
can
be
found
in
Application
Note
826,
Recommended
Minimum
Pad
Patterns
With
Outline
Drawing Access for Vishay Siliconix MOSFETs. Click on the
PowerPAK 1212-8 dual in the index of this document.
The gap between the two drain pads is 24 mils. This
matches the spacing of the two drain pads on the
PowerPAK SO-8 dual package.
REFLOW SOLDERING
Vishay Siliconix surface-mount packages meet solder reflow
reliability requirements. Devices are subjected to solder
reflow
as
a
test
preconditioning
and
are
then
reliability-tested using temperature cycle, bias humidity,
HAST, or pressure pot. The solder reflow temperature profile
used, and the temperatures and time duration, are shown in
figures 3 and 4.
For
the
lead
(Pb)-free
solder
profile,
see
www.vishay.com/doc?73257.
Fig. 3 Solder Reflow Temperature Profile
Fig. 4 Solder Reflow Temperatures and Time Durations
Ramp-Up Rate
+ 3 °C /s max.
Temperature at 150 - 200 °C
120 s max.
Temperature Above 217 °C
60 - 150 s
Maximum Temperature
255 + 5/- 0 °C
Time at Maximum
Temperature
30 s
Ramp-Down Rate
+ 6 °C/s max.
260 °C
3 °C(max)
6 °C/s (max.)
30 s
217 °C
150 s (max.)
Reflow Zone
60 s (min.)
Pre-Heating Zone
150 - 200 °C
Maximum peak temperature at 240 °C is allowed.


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