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LP8731-Q1 Datasheet(PDF) 5 Page - Texas Instruments |
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LP8731-Q1 Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 51 page  LP8731-Q1 www.ti.com SNVSA28 – DECEMBER 2014 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VIN, SDA, SCL −0.3 6 V GND to GND SLUG ±0.3 Power dissipation (PD_MAX) Internally limited Junction temperature (TJ-MAX) 150 Maximum lead temperature (soldering) 260 °C Storage temperature (Tstg ) –65 150 (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per AEC Q100-002(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per AEC Q100-011 ±750 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.3 Recommended Operating Conditions (Bucks) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN 2.8 5.5 V VEN 0 (VIN + 0.3) Junction temperature (TJ) –40 125 °C Ambient temperature (TA) –40 125 7.4 Thermal Information LP8731-Q1 THERMAL METRIC(1) DSBGA (YZR) UNIT 25 PINS RθJA Junction-to-ambient thermal resistance 58.7 RθJC(top) Junction-to-case (top) thermal resistance 0.3 RθJB Junction-to-board thermal resistance 8 °C/W ψJT Junction-to-top characterization parameter 0.6 ψJB Junction-to-board characterization parameter 8 RθJC(bot) Junction-to-case (bottom) thermal resistance n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LP8731-Q1 |
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